P

Inventor

CHEN CHENG-HUNG

CN94 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHENG-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

14 patents
US9594862B2Mar 14, 2017

Method of fabricating an integrated circuit with non-printable dummy features

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92
US9436788B2Sep 6, 2016

Method of fabricating an integrated circuit with block dummy for optimized pattern density uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9436787B2Sep 6, 2016

Method of fabricating an integrated circuit with optimized pattern density uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US11061317B2Jul 13, 2021

Method of fabricating an integrated circuit with non-printable dummy features

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10811225B2Oct 20, 2020

Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10431423B2Oct 1, 2019

Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10359695B2Jul 23, 2019

Method of fabricating an integrated circuit with non-printable dummy features

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10170276B2Jan 1, 2019

Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12153433B2Nov 26, 2024

Systems and methods for raised floor automated sensor vehicles

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11334080B2May 17, 2022

Systems and methods for raised floor automated sensor vehicles

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11984419B2May 14, 2024

Package structure with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11469203B2Oct 11, 2022

Method for forming package structure with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11152238B2Oct 19, 2021

Semiconductor processing stage profiler jig

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9552964B2Jan 24, 2017

Method of fabricating an integrated circuit with a pattern density-outlier-treatment for optimized pattern density uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

SHENZHEN CHINA STAR OPTOELECT

11 patents

CHEN CHENG-HUNG

7 patents

BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO LTD

3 patents

NAN YA PLASTICS CORP

3 patents

TAIWAN SEMICONDUCTOR MFG

2 patents

WANG HUNG-CHUN

1 patent

CHEN PEI-SHIANG

1 patent

CHENXERGO INC

1 patent

DELL PRODUCTS LP

1 patent

NANYA PLASTICS CORP

1 patent

ACER INC

1 patent

VIA TECH INC

1 patent

IND TECH RES INST

1 patent

WISTRON CORP

1 patent

NOVATEK MICROELECTRONICS CORP

1 patent

Showing the top 50 of 94 patents by PatentIndex Score.