Inventor
FU XINYU
US51 patents
⚠️ This page may combine multiple inventors who share the name “FU XINYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
33 patentsUS10121671B2Nov 6, 2018
Methods of depositing metal films using metal oxyhalide precursors
APPLIED MATERIALS INC429 citations99
US7695567B2Apr 13, 2010
Water vapor passivation of a wall facing a plasma
APPLIED MATERIALS INC61 citations98
US9685371B2Jun 20, 2017
Method of enabling seamless cobalt gap-fill
APPLIED MATERIALS INC35 citations94
US9601339B2Mar 21, 2017
Methods for depositing fluorine/carbon-free conformal tungsten
APPLIED MATERIALS INC13 citations92
US9230815B2Jan 5, 2016
Methods for depositing fluorine/carbon-free conformal tungsten
APPLIED MATERIALS INC17 citations92
US9082702B2Jul 14, 2015
Atomic layer deposition methods for metal gate electrodes
APPLIED MATERIALS INC18 citations84
US8951913B2Feb 10, 2015
Method for removing native oxide and associated residue from a substrate
APPLIED MATERIALS INC5 citations84
US8765601B2Jul 1, 2014
Post deposition treatments for CVD cobalt films
APPLIED MATERIALS INC6 citations84
US8021514B2Sep 20, 2011
Remote plasma source for pre-treatment of substrates prior to deposition
APPLIED MATERIALS INC10 citations84
US7658802B2Feb 9, 2010
Apparatus and a method for cleaning a dielectric film
APPLIED MATERIALS INC8 citations84
US7615489B1Nov 10, 2009
Method for forming metal interconnects and reducing metal seed layer overhang
APPLIED MATERIALS INC17 citations84
US7704887B2Apr 27, 2010
Remote plasma pre-clean with low hydrogen pressure
APPLIED MATERIALS INC10 citations83
US7686926B2Mar 30, 2010
Multi-step process for forming a metal barrier in a sputter reactor
APPLIED MATERIALS INC16 citations83
US10043709B2Aug 7, 2018
Methods for thermally forming a selective cobalt layer
APPLIED MATERIALS INC5 citations73
US9842769B2Dec 12, 2017
Method of enabling seamless cobalt gap-fill
APPLIED MATERIALS INC3 citations73
US9230835B2Jan 5, 2016
Integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devices
APPLIED MATERIALS INC6 citations73
US8987080B2Mar 24, 2015
Methods for manufacturing metal gates
APPLIED MATERIALS INC4 citations73
US10199230B2Feb 5, 2019
Methods for selective deposition of metal silicides via atomic layer deposition cycles
APPLIED MATERIALS INC3 citations72
US9947578B2Apr 17, 2018
Methods for forming low-resistance contacts through integrated process flow systems
APPLIED MATERIALS INC2 citations72
US9595466B2Mar 14, 2017
Methods for etching via atomic layer deposition (ALD) cycles
APPLIED MATERIALS INC2 citations72
US7618893B2Nov 17, 2009
Methods of forming a layer for barrier applications in an interconnect structure
APPLIED MATERIALS INC6 citations68
US9145612B2Sep 29, 2015
Deposition of N-metal films comprising aluminum alloys
APPLIED MATERIALS INC3 citations63
US8349724B2Jan 8, 2013
Method for improving electromigration lifetime of copper interconnection by extended post anneal
APPLIED MATERIALS INC4 citations63
US7807568B2Oct 5, 2010
Methods for reducing damage to substrate layers in deposition processes
APPLIED MATERIALS INC2 citations63
US7618521B2Nov 17, 2009
Split magnet ring on a magnetron sputter chamber
APPLIED MATERIALS INC5 citations63
US11887855B2Jan 30, 2024
Methods for depositing fluorine/carbon-free conformal tungsten
APPLIED MATERIALS INC0 citations62
US10985023B2Apr 20, 2021
Methods for depositing fluorine/carbon-free conformal tungsten
APPLIED MATERIALS INC0 citations62
US10718049B2Jul 21, 2020
Process kit shield for improved particle reduction
APPLIED MATERIALS INC0 citations52
US10699946B2Jun 30, 2020
Method of enabling seamless cobalt gap-fill
APPLIED MATERIALS INC0 citations52
US10483116B2Nov 19, 2019
Methods of depositing metal films using metal oxyhalide precursors
APPLIED MATERIALS INC0 citations52
US10269633B2Apr 23, 2019
Method of enabling seamless cobalt gap-fill
APPLIED MATERIALS INC0 citations52
US9922872B2Mar 20, 2018
Tungsten films by organometallic or silane pre-treatment of substrate
APPLIED MATERIALS INC0 citations52
US8927423B2Jan 6, 2015
Methods for annealing a contact metal layer to form a metal silicidation layer
APPLIED MATERIALS INC1 citations49
FU XINYU
4 patentsUS8580354B2Nov 12, 2013
Plasma treatment of substrates prior to deposition
FU XINYU11 citations82
US8586479B2Nov 19, 2013
Methods for forming a contact metal layer in semiconductor devices
FU XINYU2 citations61
US8852674B2Oct 7, 2014
Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers
FU XINYU1 citations51
US8168543B2May 1, 2012
Methods of forming a layer for barrier applications in an interconnect structure
FU XINYU0 citations45
ANTICANCER INC
3 patentsZHENG BO
2 patentsZOPE BHUSHAN N
1 patentLEI YU
1 patentGUNG TZA-JING
1 patentZOOMLION HEAVY INDUSTRY SCIENCE AND TECH CO LTD
1 patentRASHEED MUHAMMAD
1 patentYU JICK M
1 patentSUBRAMANI ANANTHA K
1 patentLEI JIANXIN
1 patentShowing the top 50 of 51 patents by PatentIndex Score.