Inventor
YAO YUSHUANG
MY36 patents
⚠️ This page may combine multiple inventors who share the name “YAO YUSHUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
34 patentsUS9620877B2Apr 11, 2017
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations92
US11315859B1Apr 26, 2022
Power module
SEMICONDUCTOR COMPONENTS IND LLC5 citations84
US10720725B2Jul 21, 2020
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations84
US11452225B2Sep 20, 2022
Fin frame assemblies
SEMICONDUCTOR COMPONENTS IND LLC4 citations73
US11342237B2May 24, 2022
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC4 citations73
US10861767B2Dec 8, 2020
Package structure with multiple substrates
SEMICONDUCTOR COMPONENTS IND LLC6 citations73
US10861775B2Dec 8, 2020
Connecting clip design for pressure sintering
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10825748B2Nov 3, 2020
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10559905B2Feb 11, 2020
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC3 citations73
US10224655B2Mar 5, 2019
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US10121763B2Nov 6, 2018
Clip and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US9911712B2Mar 6, 2018
Clip and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US11710687B2Jul 25, 2023
Semiconductor package with guide pin
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US9967986B2May 8, 2018
Semiconductor package and method therefor
SEMICONDUCTOR COMPONENTS IND LLC1 citations63
US12308297B2May 20, 2025
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12300558B2May 13, 2025
Substrates and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12033904B2Jul 9, 2024
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11894292B2Feb 6, 2024
Power module
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11804421B2Oct 31, 2023
Connecting clip design for pressure sintering
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11672087B2Jun 6, 2023
Semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11482468B2Oct 25, 2022
Power module package casing with protrusion supports
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11272625B2Mar 8, 2022
Method for forming a semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC1 citations62
US10971428B2Apr 6, 2021
Semiconductor baseplates
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10966335B2Mar 30, 2021
Fin frame assemblies
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10897821B2Jan 19, 2021
Method of making single reflow power pin connections
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10231340B2Mar 12, 2019
Single reflow power pin connections
SEMICONDUCTOR COMPONENTS IND LLC1 citations62
US12402264B2Aug 26, 2025
Stacked power terminals in a power electronics module
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12525519B2Jan 13, 2026
Semiconductor package with guide pin
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12131981B2Oct 29, 2024
Power module package baseplate with step recess design
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11735504B2Aug 22, 2023
Power module package baseplate with step recess design
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11081828B2Aug 3, 2021
Power module housing
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
USD922329SJun 15, 2021
Press-fit pin case
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US12513870B2Dec 30, 2025
Power module
SEMICONDUCTOR COMPONENTS IND LLC0 citations46
US10319659B2Jun 11, 2019
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations45