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Power device package

74
Assignee: SEMICONDUCTOR COMPONENTS INDPriority: Feb 18, 2015Filed: Feb 18, 2015Granted: May 10, 2016
Est. expiryFeb 18, 2035(~8.6 yrs left)· nominal 20-yr term from priority
Inventors:Atapol PrajuckamolChee Hiong ChewYushuang Yao
74
PatentIndex Score
16
Cited by
32
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a power device package, as shown and described.

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