Inventor · disambiguated record
Yushuang Yao
Also filed as: YAO YUSHUANG
35 granted patents·6 pending applications·76 citations·filing 2014–2025
96Inventor score
Top patents by PatentIndex Score
41 records- 0198US10720725B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 21, 2020·8 cites·20 claims
- 0297US11315859B1Power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 26, 2022·5 cites·20 claims
- 0396US11452225B2Fin frame assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 20, 2022·4 cites·18 claims
- 0496US9620877B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Apr 11, 2017·15 cites·14 claims
- 0589US10861767B2Package structure with multiple substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 8, 2020·6 cites·20 claims
- 0687US11342237B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 24, 2022·4 cites·5 claims
- 0787US10559905B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 11, 2020·3 cites·20 claims
- 0880US2025380369A1Stacked power terminals in a power electronics moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0979US2025266305A1Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1078US12131981B2Power module package baseplate with step recess designSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 29, 2024·0 cites·22 claims
- 1178US10861775B2Connecting clip design for pressure sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 8, 2020·2 cites·14 claims
- 1278US10121763B2Clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 6, 2018·2 cites·20 claims
- 1378US2025054839A1Power module package baseplate with step recess designSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1476US12308297B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1576US11710687B2Semiconductor package with guide pinSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 25, 2023·2 cites·18 claims
- 1676US10825748B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Nov 3, 2020·2 cites·5 claims
- 1776US9911712B2Clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Mar 6, 2018·2 cites·13 claims
- 1874USD755741SPower device packageSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted May 10, 2016·16 cites·1 claims
- 1973US12402264B2Stacked power terminals in a power electronics moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Aug 26, 2025·0 cites·22 claims
- 2073US11672087B2Semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jun 6, 2023·0 cites·20 claims
- 2173US10224655B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 5, 2019·1 cites·12 claims
- 2271US11272625B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 8, 2022·1 cites·20 claims
- 2370US11894292B2Power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 2470US9967986B2Semiconductor package and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted May 8, 2018·1 cites·19 claims
- 2568US11735504B2Power module package baseplate with step recess designSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 22, 2023·0 cites·20 claims
- 2667US12033904B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 9, 2024·0 cites·19 claims
- 2767US10231340B2Single reflow power pin connectionsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Mar 12, 2019·1 cites·6 claims
- 2865US11804421B2Connecting clip design for pressure sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 31, 2023·0 cites·28 claims
- 2965US10966335B2Fin frame assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 30, 2021·0 cites·16 claims
- 3065US2025149419A1Housings for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3164US12300558B2Substrates and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·17 claims
- 3258US2021265248A1Housings for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 3357US10897821B2Method of making single reflow power pin connectionsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 19, 2021·0 cites·20 claims
- 3455US11482468B2Power module package casing with protrusion supportsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 3554US2024038632A1Direct substrate-side cooling in power device moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 3653US10971428B2Semiconductor baseplatesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Apr 6, 2021·0 cites·18 claims
- 3752US12513870B2Power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 30, 2025·0 cites·24 claims
- 3850US11081828B2Power module housingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Aug 3, 2021·0 cites·23 claims
- 3950USD922329SPress-fit pin caseSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 15, 2021·0 cites·1 claims
- 4042US10319659B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 4134USD755742SPower device packageSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted May 10, 2016·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →