Inventor · disambiguated record
Atapol Prajuckamol
Also filed as: PRAJUCKAMOL ATAPOL
54 granted patents·17 pending applications·143 citations·filing 2007–2025
98Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC63SEMICONDUCTOR COMPONENTS IND6PRAJUCKAMOL ATAPOL1TEH SERENE SEOH HIAN1
Top patents by PatentIndex Score
71 records- 0198US11955412B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 9, 2024·8 cites·19 claims
- 0298US11948870B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 2, 2024·8 cites·19 claims
- 0398US11908840B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·8 cites·20 claims
- 0498US11894347B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·8 cites·20 claims
- 0598US11469163B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 11, 2022·8 cites·20 claims
- 0698US10720725B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 21, 2020·8 cites·20 claims
- 0796US11452225B2Fin frame assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 20, 2022·4 cites·18 claims
- 0896US9620877B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Apr 11, 2017·15 cites·14 claims
- 0992US11462515B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 4, 2022·8 cites·12 claims
- 1091US2025336783A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1190US2025323222A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1289US10861767B2Package structure with multiple substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 8, 2020·6 cites·20 claims
- 1389US2025309199A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1487US12362266B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 1587US12347755B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 1687US11342237B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 24, 2022·4 cites·5 claims
- 1787US10559905B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 11, 2020·3 cites·20 claims
- 1886US12355009B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1986US12347812B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2084US9570832B2Press-fit pin for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Feb 14, 2017·5 cites·20 claims
- 2181US2025379124A1Power circuit moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 2279US7736951B2Circuit component and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Jun 15, 2010·11 cites·18 claims
- 2379US2025266305A1Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 2478US10861775B2Connecting clip design for pressure sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Dec 8, 2020·2 cites·14 claims
- 2578US10121763B2Clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 6, 2018·2 cites·20 claims
- 2677US2025118640A1Multiple substrate package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 2776US12308297B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 2876US11710687B2Semiconductor package with guide pinSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 25, 2023·2 cites·18 claims
- 2976US10825748B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Nov 3, 2020·2 cites·5 claims
- 3076US9911712B2Clip and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Mar 6, 2018·2 cites·13 claims
- 3174USD755741SPower device packageSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted May 10, 2016·16 cites·1 claims
- 3273US11672087B2Semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jun 6, 2023·0 cites·20 claims
- 3373US10224655B2Flexible press fit pins for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 5, 2019·1 cites·12 claims
- 3473US10056317B1Semiconductor package with grounding device and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Aug 21, 2018·2 cites·20 claims
- 3571US12394692B2Power circuit moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Aug 19, 2025·0 cites·16 claims
- 3671US11272625B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 8, 2022·1 cites·20 claims
- 3771US11217506B2Semiconductor device assemblies including low-stress spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 4, 2022·1 cites·16 claims
- 3871US2025246572A1Clip design and method of controlling clip positionSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3970US12283562B2Clip design and method of controlling clip positionSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 4070US9967986B2Semiconductor package and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted May 8, 2018·1 cites·19 claims
- 4169US11374373B2Press-fit pin for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims
- 4268US10971429B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 6, 2021·0 cites·16 claims
- 4367US12033904B2Semiconductor package system and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 9, 2024·0 cites·19 claims
- 4467US10231340B2Single reflow power pin connectionsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Mar 12, 2019·1 cites·6 claims
- 4567US8759978B2Chip-on-lead package and method of formingPRAJUCKAMOL ATAPOL·Filed 2012·Granted Jun 24, 2014·4 cites·20 claims
- 4666US12211775B2Multiple substrate package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jan 28, 2025·0 cites·20 claims
- 4765US11804421B2Connecting clip design for pressure sinteringSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 31, 2023·0 cites·28 claims
- 4865US10966335B2Fin frame assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 30, 2021·0 cites·16 claims
- 4964US12300558B2Substrates and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·17 claims
- 5063US10693270B2Press-fit pin for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 23, 2020·1 cites·19 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →