Inventor · disambiguated record
Abelardo Hadap Advincula
Also filed as: ADVINCULA ABELARDO HADAP · ADVINCULA ABELARDO JR HADAP · ADVINCULA JR ABELARDO HADAP
6 granted patents·1 pending application·45 citations·filing 2007–2008
80Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0190US7868471B2Integrated circuit package-in-package system with leadsSTATS CHIPPAC LTD·Filed 2007·Granted Jan 11, 2011·22 cites·8 claims
- 0283US7919850B2Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereofSTATS CHIPPAC LTD·Filed 2008·Granted Apr 5, 2011·12 cites·20 claims
- 0375US7732901B2Integrated circuit package system with isloated leadsSTATS CHIPPAC LTD·Filed 2008·Granted Jun 8, 2010·6 cites·20 claims
- 0469US8115305B2Integrated circuit package system with thin profileCAMACHO ZIGMUND RAMIREZ·Filed 2007·Granted Feb 14, 2012·4 cites·20 claims
- 0558US8207600B2Integrated circuit package system with encapsulating featuresBATHAN HENRY DESCALZO·Filed 2007·Granted Jun 26, 2012·1 cites·20 claims
- 0645US8421198B2Integrated circuit package system with external interconnects at high densityTAY LIONEL CHIEN HUI·Filed 2007·Granted Apr 16, 2013·0 cites·9 claims
- 0743US2008308933A1Integrated circuit package system with different connection structuresTAY LIONEL CHIEN HUI·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →