Inventor · disambiguated record
Abiola Awujoola
Also filed as: AWUJOOLA ABIOLA · AWUJOOLA ABIOLA A
14 granted patents·5 pending applications·148 citations·filing 2002–2025
92Inventor score
Technology areasH10W
Files withINVENSAS CORP7LSI LOGIC CORP4FISHLEY CLIFFORD R3ADEIA SEMICONDUCTOR TECH LLC2INVENSAS LLC2
Top patents by PatentIndex Score
19 records- 0198US10115678B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2017·Granted Oct 30, 2018·26 cites·20 claims
- 0298US9812402B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·30 cites·20 claims
- 0397US11810867B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2022·Granted Nov 7, 2023·2 cites·28 claims
- 0497US9490222B1Wire bond wires for interference shieldingINVENSAS CORP·Filed 2015·Granted Nov 8, 2016·20 cites·20 claims
- 0596US10559537B2Wire bond wires for interference shieldingINVENSAS CORP·Filed 2018·Granted Feb 11, 2020·10 cites·18 claims
- 0696US9984992B2Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfacesINVENSAS CORP·Filed 2016·Granted May 29, 2018·27 cites·22 claims
- 0795US10490528B2Embedded wire bond wiresINVENSAS CORP·Filed 2016·Granted Nov 26, 2019·17 cites·10 claims
- 0891US10325877B2Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfacesINVENSAS CORP·Filed 2018·Granted Jun 18, 2019·7 cites·20 claims
- 0990US11462483B2Wire bond wires for interference shieldingINVENSAS LLC·Filed 2019·Granted Oct 4, 2022·3 cites·24 claims
- 1086US12255153B2Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2023·Granted Mar 18, 2025·0 cites·25 claims
- 1182US2025253264A1Wire bond wires for interference shieldingADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 1260US7750460B2Ball grid array package layout supporting many voltage splits and flexible split locationsLSI CORP·Filed 2008·Granted Jul 6, 2010·2 cites·20 claims
- 1355US7804167B2Wire bond integrated circuit package for high speed I/OLSI LOGIC CORP·Filed 2006·Granted Sep 28, 2010·1 cites·17 claims
- 1447US7166492B2Integrated circuit carrier apparatus method and systemLSI LOGIC CORP·Filed 2003·Granted Jan 23, 2007·3 cites·25 claims
- 1536US6748576B2Active trace reroutingLSI LOGIC CORP·Filed 2002·Granted Jun 8, 2004·0 cites·12 claims
- 1636US2005104164A1EMI shielded integrated circuit packaging apparatus method and systemLSI LOGIC CORP·Filed 2003·Application pending·0 cites
- 1735US2012126387A1Enhanced heat spreader for use in an electronic device and method of manufacturing the sameFISHLEY CLIFFORD R·Filed 2010·Application pending·0 cites
- 1831US2013161805A1Integrated circuit (ic) leadframe designFISHLEY CLIFFORD R·Filed 2011·Application pending·0 cites
- 1930US2013161804A1Integrated circuit (ic) leadframe designFISHLEY CLIFFORD R·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →