Inventor · disambiguated record
Abderrezak Marzaki
Also filed as: MARZAKI ABDERREZAK
56 granted patents·13 pending applications·57 citations·filing 2013–2025
97Inventor score
Files withST MICROELECTRONICS ROUSSET61ST MICROELECTRONICS CROLLES 2 SAS3ST MICROELECTRONICS INT NV3STMICROELECTRONICS ROUSSET1STMICROELECTRONICSA ROUSSET SAS1
Top patents by PatentIndex Score
69 records- 0197US10109601B2Integrated circuit with detection of thinning via the back face and decoupling capacitorsST MICROELECTRONICS ROUSSET·Filed 2017·Granted Oct 23, 2018·18 cites·32 claims
- 0296US11935828B2Integrated filler capacitor cell device and corresponding manufacturing methodST MICROELECTRONICS ROUSSET·Filed 2023·Granted Mar 19, 2024·2 cites·26 claims
- 0394US11626365B2Co-integrated vertically structured capacitive element and fabrication processST MICROELECTRONICS ROUSSET·Filed 2021·Granted Apr 11, 2023·2 cites·21 claims
- 0493US11621222B2Integrated filler capacitor cell device and corresponding manufacturing methodST MICROELECTRONICS ROUSSET·Filed 2021·Granted Apr 4, 2023·2 cites·28 claims
- 0593US10818669B2Integrated circuit with vertically structured capacitive element, and its fabricating processST MICROELECTRONICS ROUSSET·Filed 2018·Granted Oct 27, 2020·8 cites·27 claims
- 0690US11139303B2Integrated circuit with vertically structured capacitive element, and its fabricating processST MICROELECTRONICS ROUSSET·Filed 2020·Granted Oct 5, 2021·2 cites·22 claims
- 0790US11081488B2Integrated circuit with vertically structured capacitive element, and its fabricating processST MICROELECTRONICS ROUSSET·Filed 2020·Granted Aug 3, 2021·2 cites·21 claims
- 0887US10379254B2Method for producing an integrated circuit pointed element comprising etching first and second etchable materials with a particular etchant to form an open crater in a projectionST MICROELECTRONICS ROUSSET·Filed 2015·Granted Aug 13, 2019·3 cites·22 claims
- 0987US2025309097A1Co-integrated vertically structured capacitive element and fabrication processST MICROELECTRONICS ROUSSET·Filed 2025·Application pending·0 cites
- 1086US10971578B2Capacitive electronic chip componentST MICROELECTRONICS ROUSSET·Filed 2019·Granted Apr 6, 2021·3 cites·20 claims
- 1186US10615086B2Method of detecting a possible thinning of a substrate of an integrated circuit via the rear face thereof, and associated deviceST MICROELECTRONICS ROUSSET·Filed 2018·Granted Apr 7, 2020·3 cites·13 claims
- 1283US11004785B2Co-integrated vertically structured capacitive element and fabrication processST MICROELECTRONICS ROUSSET·Filed 2019·Granted May 11, 2021·2 cites·22 claims
- 1383US10886283B2Compact antifuse element and fabrication processST MICROELECTRONICS ROUSSET·Filed 2019·Granted Jan 5, 2021·3 cites·33 claims
- 1483US10453808B2Method for detecting thinning of an integrated circuit substrate via its rear face, and corresponding integrated circuitST MICROELECTRONICS ROUSSET·Filed 2018·Granted Oct 22, 2019·3 cites·12 claims
- 1582US12230565B2Integrated filler capacitor cell device and corresponding manufacturing methodST MICROELECTRONICS ROUSSET·Filed 2024·Granted Feb 18, 2025·0 cites·23 claims
- 1681US12360135B2Method for producing an integrated circuit pointed element comprising etching first and second etchable materials with a particular etchant to form an open crater in a projectionST MICROELECTRONICS ROUSSET·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1781US12334429B2Co-integrated vertically structured capacitive element and fabrication processST MICROELECTRONICS ROUSSET·Filed 2023·Granted Jun 17, 2025·0 cites·9 claims
- 1880US11164875B2Method for manufacturing a capacitive element having electrical coupling the first electrode to the active regionST MICROELECTRONICS ROUSSET·Filed 2020·Granted Nov 2, 2021·1 cites·18 claims
- 1979US12142536B2Method of detecting a possible thinning of a substrate of an integrated circuit via the rear face thereof, and associated deviceST MICROELECTRONICS ROUSSET·Filed 2022·Granted Nov 12, 2024·0 cites·16 claims
- 2079US10879233B2Process for fabricating capacitive elements in trenchesST MICROELECTRONICS ROUSSET·Filed 2018·Granted Dec 29, 2020·2 cites·20 claims
- 2174US2023326883A1Integrated ultralong time constant time measurement device and fabrication processST MICROELECTRONICS ROUSSET·Filed 2023·Application pending·0 cites
- 2272US12198973B2Integrated circuit comprising trenches formed in a substrateST MICROELECTRONICS ROUSSET·Filed 2023·Granted Jan 14, 2025·0 cites·8 claims
- 2370US11605702B2Method of manufacturing an integrated circuit comprising a capacitive elementST MICROELECTRONICS ROUSSET·Filed 2021·Granted Mar 14, 2023·0 cites·13 claims
- 2470US11296039B2Integrated circuit with detection of thinning via the back face and decoupling capacitorsST MICROELECTRONICS ROUSSET·Filed 2020·Granted Apr 5, 2022·0 cites·14 claims
- 2570US10535672B2Integrated circuit with decoupling capacitor in a structure of the triple well typeST MICROELECTRONICS ROUSSET·Filed 2017·Granted Jan 14, 2020·1 cites·17 claims
- 2669US2025015188A1Triple-gate mos transistor and method for manufacturing such a transistorST MICROELECTRONICS ROUSSET·Filed 2024·Application pending·0 cites
- 2768US11721646B2Integrated ultralong time constant time measurement device and fabrication processST MICROELECTRONICS ROUSSET·Filed 2021·Granted Aug 8, 2023·0 cites·29 claims
- 2868US11637106B2Capacitive element comprising a monolithic conductive region having one part covering a front surface of a substrate and at least one part extending into an active region perpendicularly to the front surfaceST MICROELECTRONICS ROUSSET·Filed 2021·Granted Apr 25, 2023·0 cites·15 claims
- 2967US11562933B2Method of detecting a possible thinning of a substrate of an integrated circuit via the rear face thereof, and associated deviceST MICROELECTRONICS ROUSSET·Filed 2020·Granted Jan 24, 2023·0 cites·4 claims
- 3066US11536872B2Method for producing an integrated circuit pointed element comprising etching first and second etchable materials with a particular etchant to form an open crater in a projectST MICROELECTRONICS ROUSSET·Filed 2019·Granted Dec 27, 2022·0 cites·21 claims
- 3165US12063775B2Read only memoryST MICROELECTRONICS ROUSSET·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 3265US11943931B2Non-volatile memory device with vertical state transistor and vertical selection transistorST MICROELECTRONICS ROUSSET·Filed 2021·Granted Mar 26, 2024·0 cites·17 claims
- 3365US11710711B2Integrated circuit provided with decoys against reverse engineering and corresponding fabrication processST MICROELECTRONICS ROUSSET·Filed 2021·Granted Jul 25, 2023·0 cites·13 claims
- 3465US11640972B2Process for fabricating a high-voltage capacitive element, and corresponding integrated circuitST MICROELECTRONICS ROUSSET·Filed 2022·Granted May 2, 2023·0 cites·9 claims
- 3563US10937746B2Integrated ultralong time constant time measurement device and fabrication processST MICROELECTRONICS ROUSSET·Filed 2019·Granted Mar 2, 2021·0 cites·11 claims
- 3662US11942440B2Method for detecting a differential fault analysis attack and a thinning of the substrate in an integrated circuit, and associated integrated circuitST MICROELECTRONICS ROUSSET·Filed 2020·Granted Mar 26, 2024·0 cites·18 claims
- 3762US11830777B2Method for manufacturing a microelectronic deviceST MICROELECTRONICS ROUSSET·Filed 2022·Granted Nov 28, 2023·0 cites·29 claims
- 3861US10943973B2Integrated circuit comprising low voltage capacitive elementsST MICROELECTRONICS ROUSSET·Filed 2019·Granted Mar 9, 2021·0 cites·18 claims
- 3961US2024324196A1Bit-erasable embedded select in trench memory (estm)ST MICROELECTRONICS ROUSSET·Filed 2024·Application pending·0 cites
- 4060US11818883B2Read only memoryST MICROELECTRONICS CROLLES 2 SAS·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 4160US11640921B2Process for fabricating an integrated circuit comprising a phase of forming trenches in a substrate and corresponding integrated circuitST MICROELECTRONICS ROUSSET·Filed 2020·Granted May 2, 2023·0 cites·19 claims
- 4260US2025261368A1Integrated circuit comprising at least one bipolar transistor and a corresponding method of productionST MICROELECTRONICS ROUSSET·Filed 2025·Application pending·0 cites
- 4360US2024429232A1Integrated circuit including a capacitive element, and corresponding manufacturing methodST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 4459US11271075B2Process for fabricating a high-voltage capacitive element, and corresponding integrated circuitST MICROELECTRONICS ROUSSET·Filed 2020·Granted Mar 8, 2022·0 cites·9 claims
- 4559US10804223B2Integrated circuit with detection of thinning via the back face and decoupling capacitorsST MICROELECTRONICS ROUSSET·Filed 2018·Granted Oct 13, 2020·0 cites·26 claims
- 4659US10651184B2Integrated circuit with decoupling capacitor in a structure of the triple well typeST MICROELECTRONICS ROUSSET·Filed 2019·Granted May 12, 2020·0 cites·13 claims
- 4758US12414360B2Integrated circuit including at least one capacitive element and corresponding manufacturing methodST MICROELECTRONICS ROUSSET·Filed 2022·Granted Sep 9, 2025·0 cites·22 claims
- 4857US12035522B2Bit-erasable embedded Select in Trench Memory (eSTM)ST MICROELECTRONICS ROUSSET·Filed 2022·Granted Jul 9, 2024·0 cites·19 claims
- 4957US11069628B2Integrated circuit provided with decoys against reverse engineering and corresponding fabrication processST MICROELECTRONICS ROUSSET·Filed 2019·Granted Jul 20, 2021·0 cites·18 claims
- 5057US2024030357A1Method for manufacturing a schottky diode and corresponding integrated circuitST MICROELECTRONICS ROUSSET·Filed 2023·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Abderrezak Marzaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →