Inventor · disambiguated record
Achyuta Achari
Also filed as: ACHARI ACHYUTA · BAKER JAY DEAVIS
27 granted patents·592 citations·filing 1979–2003
97Inventor score
Top patents by PatentIndex Score
27 records- 0195US6250541B1Method of forming interconnections on electronic modulesVISTEON GLOBAL TECH INC·Filed 2000·Granted Jun 26, 2001·100 cites·2 claims
- 0292US5863493ALead-free solder compositionsFORD MOTOR CO·Filed 1996·Granted Jan 26, 1999·83 cites·8 claims
- 0389US5429689ALead-free solder alloysFORD MOTOR CO·Filed 1994·Granted Jul 4, 1995·39 cites·17 claims
- 0487US6082610AMethod of forming interconnections on electronic modulesFORD MOTOR CO·Filed 1997·Granted Jul 4, 2000·72 cites·12 claims
- 0581US6601292B2Method for the connection and repair of flex and other circuitsVISTEON GLOBAL TECH INC·Filed 2001·Granted Aug 5, 2003·24 cites·9 claims
- 0680US6011313AFlip chip interconnections on electronic modulesFORD MOTOR CO·Filed 1999·Granted Jan 4, 2000·44 cites·1 claims
- 0773US5996222ASoldering process with minimal thermal impact on substrateFORD MOTOR CO·Filed 1998·Granted Dec 7, 1999·36 cites·12 claims
- 0869US6852932B2Circuit board with air-bridgeVISTEON GLOBAL TECH INC·Filed 2003·Granted Feb 8, 2005·12 cites·7 claims
- 0967US6998293B2Flip-chip bonding methodVISTEON GLOBAL TECH INC·Filed 2002·Granted Feb 14, 2006·18 cites·10 claims
- 1067US6274819B1Method and article for the connection and repair of flex and other circuitsVISTEON GLOBAL TECH INC·Filed 1999·Granted Aug 14, 2001·23 cites·15 claims
- 1165US6555015B1Multi-layer printed circuit board and method of making sameVISTEON GLOBAL TECH INC·Filed 2000·Granted Apr 29, 2003·10 cites·16 claims
- 1264US7156279B2System and method for mounting electronic components onto flexible substratesVISTEON GLOBAL TECHNOLOGIE INC·Filed 2001·Granted Jan 2, 2007·14 cites·17 claims
- 1364US6307240B1Pulsed etching manufacturing method and systemVISTEON GLOBAL TECH INC·Filed 2000·Granted Oct 23, 2001·9 cites·15 claims
- 1461US6459041B1Etched tri-layer metal bonding layerVISTEON GLOBAL TECH INC·Filed 2000·Granted Oct 1, 2002·8 cites·5 claims
- 1561US5871690ALow-temperature solder compositionsFORD MOTOR CO·Filed 1997·Granted Feb 16, 1999·19 cites·6 claims
- 1658US6168725B1Etching of Al-Cu layers to form electronic circuits using base solutions including nitrites, borates or bromatesVISTEON GLOBAL TECH INC·Filed 1997·Granted Jan 2, 2001·19 cites·9 claims
- 1756US6403893B2Circuit board and a method for making the sameVISTEON GLOBAL TECH INC·Filed 2001·Granted Jun 11, 2002·6 cites·20 claims
- 1855US6454878B1Cladded material construction for etched-tri-metal circuitsVISTEON GLOBAL TECH INC·Filed 2000·Granted Sep 24, 2002·5 cites·11 claims
- 1950US6810723B2Engine combustion monitoring and control with integrated cylinder head gasket combustion sensorVISTEON GLOBAL TECH INC·Filed 2002·Granted Nov 2, 2004·3 cites·27 claims
- 2049US4237722AExhaust gas sensor electrode improvementFORD MOTOR CO·Filed 1979·Granted Dec 9, 1980·10 cites·12 claims
- 2149US4225559ACeramic element sensorFORD MOTOR CO·Filed 1979·Granted Sep 30, 1980·11 cites·5 claims
- 2243US6270354B2Multi-connectable printed circuit boardVISTEON GLOBAL TECH INC·Filed 1999·Granted Aug 7, 2001·10 cites·20 claims
- 2340US6729023B2Method for making a multi-layer circuit board assembly having air bridges supported by polymeric materialVISTEON GLOBAL TECH INC·Filed 2001·Granted May 4, 2004·0 cites·10 claims
- 2439US6019910AEtching tri-metal layers to form electronic circuits using aqueous alkaline solutions including nitratesFORD MOTOR CO·Filed 1997·Granted Feb 1, 2000·7 cites·5 claims
- 2538US6475703B2Method for constructing multilayer circuit boards having air bridgesVISTEON GLOBAL TECH INC·Filed 1998·Granted Nov 5, 2002·7 cites·12 claims
- 2638US6467161B2Method for making a circuit boardVISTEON GLOBAL TECH INC·Filed 2001·Granted Oct 22, 2002·0 cites·15 claims
- 2733US6528736B1Multi-layer printed circuit board and method of making sameVISTEON GLOBAL TECH INC·Filed 1997·Granted Mar 4, 2003·3 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →