Inventor · disambiguated record
Adel A. Elsherbini
Also filed as: ELSHERBINI ADEL · ELSHERBINI ADEL A
270 granted patents·127 pending applications·833 citations·filing 2012–2025
99Inventor score
Top patents by PatentIndex Score
397 records- 0198US12080652B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2023·Granted Sep 3, 2024·3 cites·20 claims
- 0298US11990448B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted May 21, 2024·5 cites·18 claims
- 0398US10380496B2Quantum computing assembliesINTEL CORP·Filed 2018·Granted Aug 13, 2019·50 cites·25 claims
- 0498US9413079B2Single-package phased array module with interleaved sub-arraysINTEL CORP·Filed 2013·Granted Aug 9, 2016·65 cites·24 claims
- 0597US12107060B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Oct 1, 2024·5 cites·20 claims
- 0697US12062631B2Microelectronic assemblies with inductors in direct bonding regionsINTEL CORP·Filed 2020·Granted Aug 13, 2024·4 cites·20 claims
- 0797US11652059B2Composite interposer structure and method of providing sameINTEL CORP·Filed 2021·Granted May 16, 2023·5 cites·15 claims
- 0897US11469209B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Oct 11, 2022·3 cites·28 claims
- 0997US11348895B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted May 31, 2022·3 cites·23 claims
- 1097US9915978B2Method of fabricating a stretchable computing deviceINTEL CORP·Filed 2015·Granted Mar 13, 2018·35 cites·5 claims
- 1196US12057402B2Direct bonding in microelectronic assembliesINTEL CORP·Filed 2020·Granted Aug 6, 2024·3 cites·20 claims
- 1296US11967580B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2022·Granted Apr 23, 2024·2 cites·19 claims
- 1396US11791277B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Oct 17, 2023·2 cites·15 claims
- 1496US11527501B1Sacrificial redistribution layer in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 13, 2022·7 cites·11 claims
- 1596US11393766B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2020·Granted Jul 19, 2022·3 cites·18 claims
- 1696US11217535B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2017·Granted Jan 4, 2022·12 cites·20 claims
- 1796US10943851B1Reconstituted wafer assemblyINTEL CORP·Filed 2019·Granted Mar 9, 2021·18 cites·22 claims
- 1896US10756004B1Quantum computing assemblies with through-hole diesINTEL CORP·Filed 2019·Granted Aug 25, 2020·19 cites·20 claims
- 1996US10727185B2Multi-chip package with high density interconnectsINTEL CORP·Filed 2016·Granted Jul 28, 2020·11 cites·20 claims
- 2096US10319896B2Shielded interconnectsINTEL CORP·Filed 2017·Granted Jun 11, 2019·19 cites·25 claims
- 2196US9735893B1Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2016·Granted Aug 15, 2017·53 cites·20 claims
- 2295US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 2395US12165962B2Hermetic sealing structures in microelectronic assemblies having direct bondingINTEL CORP·Filed 2020·Granted Dec 10, 2024·3 cites·19 claims
- 2495US11335642B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 17, 2022·9 cites·19 claims
- 2595US11335663B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 17, 2022·8 cites·19 claims
- 2695US10658312B2Embedded millimeter-wave phased array moduleINTEL CORP·Filed 2017·Granted May 19, 2020·11 cites·13 claims
- 2795US10128177B2Multi-layer package with integrated antennaINTEL CORP·Filed 2014·Granted Nov 13, 2018·43 cites·15 claims
- 2894US11469206B2Microelectronic assembliesINTEL CORP·Filed 2018·Granted Oct 11, 2022·10 cites·25 claims
- 2994US10468578B2Package substrates with top superconductor layers for qubit devicesINTEL CORP·Filed 2018·Granted Nov 5, 2019·11 cites·25 claims
- 3094US9902152B2Piezoelectric package-integrated synthetic jet devicesINTEL CORP·Filed 2016·Granted Feb 27, 2018·5 cites·20 claims
- 3194US9832863B2Method of fabricating a stretchable computing deviceINTEL CORP·Filed 2015·Granted Nov 28, 2017·10 cites·6 claims
- 3294US9129817B2Magnetic core inductor (MCI) structures for integrated voltage regulatorsELSHERBINI ADEL A·Filed 2013·Granted Sep 8, 2015·24 cites·18 claims
- 3393US12224261B2Mixed hybrid bonding structures and methods of forming the sameINTEL CORP·Filed 2021·Granted Feb 11, 2025·2 cites·15 claims
- 3493US11616047B2Microelectronic assembliesINTEL CORP·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 3593US11581282B2Serializer-deserializer die for high speed signal interconnectINTEL CORP·Filed 2018·Granted Feb 14, 2023·10 cites·8 claims
- 3693US11562971B2Semiconductor packages with antennasINTEL CORP·Filed 2020·Granted Jan 24, 2023·2 cites·15 claims
- 3793US11494682B2Quantum computing assembliesINTEL CORP·Filed 2017·Granted Nov 8, 2022·10 cites·20 claims
- 3893US10803396B2Quantum circuit assemblies with Josephson junctions utilizing resistive switching materialsINTEL CORP·Filed 2018·Granted Oct 13, 2020·8 cites·25 claims
- 3993US9773742B2Embedded millimeter-wave phased array moduleINTEL CORP·Filed 2013·Granted Sep 26, 2017·15 cites·15 claims
- 4093US9691711B2Method of making an electromagnetic interference shield for semiconductor chip packagesINTEL CORP·Filed 2016·Granted Jun 27, 2017·9 cites·18 claims
- 4192US12288750B2Conformal power delivery structure for direct chip attach architecturesINTEL CORP·Filed 2021·Granted Apr 29, 2025·2 cites·25 claims
- 4292US11476554B2Mmwave waveguide to waveguide connectors for automotive applicationsINTEL CORP·Filed 2017·Granted Oct 18, 2022·9 cites·25 claims
- 4392US11437348B2Microelectronic assemblies with communication networksINTEL CORP·Filed 2020·Granted Sep 6, 2022·2 cites·14 claims
- 4492US11270947B2Composite interposer structure and method of providing sameINTEL CORP·Filed 2019·Granted Mar 8, 2022·5 cites·20 claims
- 4592US11049791B1Heat spreading layer integrated within a composite IC die structure and methods of forming the sameINTEL CORP·Filed 2019·Granted Jun 29, 2021·7 cites·22 claims
- 4692US10291283B2Tunable radio frequency systems using piezoelectric package-integrated switching devicesINTEL CORP·Filed 2016·Granted May 14, 2019·6 cites·22 claims
- 4792US9967040B2Patch system for in-situ therapeutic treatmentINTEL CORP·Filed 2017·Granted May 8, 2018·14 cites·20 claims
- 4892US2025349820A1Microelectronic assembliesINTEL CORP·Filed 2025·Application pending·0 cites
- 4991US11688665B2Thermal management solutions for stacked integrated circuit devicesINTEL CORP·Filed 2018·Granted Jun 27, 2023·7 cites·17 claims
- 5091US11600594B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Mar 7, 2023·1 cites·20 claims
Showing the top 50 of 397 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →