Inventor · disambiguated record
Adam Gildea
Also filed as: GILDEA ADAM
0 granted patents·8 pending applications·0 citations·filing 2022–2024
Files withTOKYO ELECTRON LTD8
Top patents by PatentIndex Score
8 records- 0151US2023075263A1Wafer bonding method using selective deposition and surface treatmentTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0249US2025096190A1Methods and devices for improving bond strength of diffusion barriersTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0349US2025180453A1Torsional shear testing for semiconductor surface bondsTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0447US2024170444A1Bonding layer and processTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0546US2024363564A1Semiconductor devices with hybrid bonding layers and process of making the sameTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0645US2025372462A1Situ wafer bond propagation measurementTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0743US2025112083A1Multi-material chuckTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0843US2025087521A1Expandable wafer bonderTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Adam Gildea files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →