Inventor · disambiguated record
Adam M. Wolski
Also filed as: WOLSKI ADAM · WOLSKI ADAM M
13 granted patents·1 pending application·456 citations·filing 1973–2001
94Inventor score
Top patents by PatentIndex Score
14 records- 0196US3998601AThin foilYATES INDUSTRIES·Filed 1973·Granted Dec 21, 1976·97 cites·36 claims
- 0287US5834140AElectrodeposited copper foil for fine pattern and method for producing the sameCIRCUIT FOIL JAPAN·Filed 1996·Granted Nov 10, 1998·78 cites·15 claims
- 0385US5863410AProcess for the manufacture of high quality very low profile copper foil and copper foil produced therebyCIRCUIT FOIL USA INC·Filed 1997·Granted Jan 26, 1999·73 cites·13 claims
- 0482US5215646ALow profile copper foil and process and apparatus for making bondable metal foilsCIRCUIT FOIL USA INC·Filed 1992·Granted Jun 1, 1993·44 cites·12 claims
- 0581US4572768ATreatment for copper foilSQUARE D CO·Filed 1985·Granted Feb 25, 1986·37 cites·8 claims
- 0665US5447619ACopper foil for the manufacture of printed circuit boards and method of producing the sameCIRCUIT FOIL USA INC·Filed 1993·Granted Sep 5, 1995·30 cites·9 claims
- 0759US6224991B1Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such processYATES FOIL USA INC·Filed 1999·Granted May 1, 2001·14 cites·11 claims
- 0855US5989727AElectrolytic copper foil having a modified shiny sideCIRCUIT FOIL USA INC·Filed 1998·Granted Nov 23, 1999·18 cites·14 claims
- 0954US4915797AContinuous process for coating printed circuit grade copper foil with a protective resinYATES INDUSTRIES·Filed 1989·Granted Apr 10, 1990·20 cites·11 claims
- 1048US6372113B2Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing sameYATES FOIL USA INC·Filed 1999·Granted Apr 16, 2002·14 cites·6 claims
- 1148US6270648B1Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foilYATES FOIL USA INC·Filed 1999·Granted Aug 7, 2001·13 cites·9 claims
- 1240US6270645B1Simplified process for production of roughened copper foilCIRCUIT FOIL USA INC·Filed 1997·Granted Aug 7, 2001·9 cites·9 claims
- 1337US2002023844A1Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foilYATES FOIL USA INC·Filed 2001·Application pending·0 cites
- 1436US5207889AMethod of producing treated copper foil, products thereof and electrolyte useful in such methodCIRCUIT FOIL USA INC·Filed 1991·Granted May 4, 1993·9 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →