Inventor · disambiguated record
Agnes Derecskei
Also filed as: DERECSKEI AGNES
4 granted patents·1 pending application·6 citations·filing 2018–2023
63Inventor score
Top patents by PatentIndex Score
5 records- 0179US11401441B2Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applicationsVERSUM MAT US LLC·Filed 2018·Granted Aug 2, 2022·4 cites·2 claims
- 0276US11111435B2Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topographyVERSUM MAT US LLC·Filed 2019·Granted Sep 7, 2021·2 cites·7 claims
- 0368US12503760B2Methods of using high-purity alkynes for selective depositionMERCK PATENT GMBH·Filed 2023·Granted Dec 23, 2025·0 cites·18 claims
- 0461US11884859B2Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topographyVERSUM MAT US LLC·Filed 2021·Granted Jan 30, 2024·0 cites·8 claims
- 0549US2025019568A1Tungsten Chemical Mechanical Polishing SlurriesVERSUM MAT US LLC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →