Inventor · disambiguated record
Akash Agrawal
Also filed as: AGRAWAL AKASH · AGRAWAL AKASH RAJESH
20 granted patents·9 pending applications·109 citations·filing 2012–2025
93Inventor score
Top patents by PatentIndex Score
29 records- 0198US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 0293US9548273B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2015·Granted Jan 17, 2017·10 cites·20 claims
- 0391US10905611B2Techniques for notifying persons within a vicinity of a patient support apparatus of a remote control functionSTRYKER CORP·Filed 2018·Granted Feb 2, 2021·12 cites·20 claims
- 0489US9728524B1Enhanced density assembly having microelectronic packages mounted at substantial angle to boardINVENSAS CORP·Filed 2016·Granted Aug 8, 2017·7 cites·19 claims
- 0586US12285373B2Techniques for notifying persons within a vicinity of a patient support apparatus of a remote control functionSTRYKER CORP·Filed 2020·Granted Apr 29, 2025·2 cites·20 claims
- 0685US10008469B2Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2016·Granted Jun 26, 2018·4 cites·13 claims
- 0781US9847238B2Fan-out wafer-level packaging using metal foil laminationINVENSAS CORP·Filed 2017·Granted Dec 19, 2017·3 cites·12 claims
- 0877US10983879B1System and method for managing recovery of multi-controller NVMe drivesEMC IP HOLDING CO LLC·Filed 2018·Granted Apr 20, 2021·2 cites·20 claims
- 0977US9471550B2Method and apparatus for document conversion with font metrics adjustment for format compatibilityLINKEDIN CORP·Filed 2012·Granted Oct 18, 2016·8 cites·18 claims
- 1076US10962137B2Universal adapter assembly for valve actuatorJOHNSON CONTROLS TECH CO·Filed 2018·Granted Mar 30, 2021·3 cites·20 claims
- 1176US9543277B1Wafer level packages with mechanically decoupled fan-in and fan-out areasINVENSAS CORP·Filed 2015·Granted Jan 10, 2017·3 cites·20 claims
- 1272US2025228722A1Techniques For Notifying Persons Within A Vicinity Of A Patient Support Apparatus Of A Remote Control FunctionSTRYKER CORP·Filed 2025·Application pending·0 cites
- 1369US2023221016A1Thermoelectric heat exchanger for an hvac systemJohnson Controls Tyco IP Holdings LLP·Filed 2023·Application pending·0 cites
- 1464US9646946B2Fan-out wafer-level packaging using metal foil laminationINVENSAS CORP·Filed 2015·Granted May 9, 2017·1 cites·6 claims
- 1560US2025259907A1Distinguished flip chip packaging for stress relaxation and enhanced em protectionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1657US2015006417A1System and method for screening applicantsLINKEDIN CORP·Filed 2013·Application pending·0 cites
- 1756US2020056795A1Thermoelectric heat exchanger for an hvac systemJOHNSON CONTROLS TECH CO·Filed 2018·Application pending·0 cites
- 1855US10790222B2Bonding of laminates with electrical interconnectsINVENSAS CORP·Filed 2019·Granted Sep 29, 2020·0 cites·17 claims
- 1949US12450518B2Evaluating on-device machine learning model(s) based on performance measures of client device(s) and/or the on-device machine learning model(s)GOOGLE LLC·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 2049US10283445B2Bonding of laminates with electrical interconnectsINVENSAS CORP·Filed 2016·Granted May 7, 2019·0 cites·10 claims
- 2149US2022308975A1Evaluating new feature(s) for client device(s) based on performance measure(s)GOOGLE LLC·Filed 2022·Application pending·0 cites
- 2247US9502372B1Wafer-level packaging using wire bond wires in place of a redistribution layerINVENSAS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·20 claims
- 2346US12278172B2Substrate frame design for three-dimensional stacked electronic assemblies and method for the sameAPPLIED MATERIALS INC·Filed 2022·Granted Apr 15, 2025·0 cites·15 claims
- 2445US11675611B2Software service intervention in a computing systemNUTANIX INC·Filed 2018·Granted Jun 13, 2023·0 cites·38 claims
- 2542US2024241997A1System and method for classifying b-rep-based cad modelsHCL TECHNOLOGIES LTD·Filed 2023·Application pending·0 cites
- 2642US2024311524A1System and method for identifying contact features of b-rep-based computer aided design modelsHCL TECHNOLOGIES LTD·Filed 2023·Application pending·0 cites
- 2739US10354945B2Multi-surface edge pads for vertical mount packages and methods of making package stacksINVENSAS CORP·Filed 2017·Granted Jul 16, 2019·0 cites·14 claims
- 2838US9859234B2Methods and structures to repair device warpageINVENSAS CORP·Filed 2015·Granted Jan 2, 2018·0 cites·12 claims
- 2938US2023297733A1Method and system for automatically identifying tube elementsHCL TECHNOLOGIES LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →