Inventor · disambiguated record
Akio Ashida
Also filed as: ASHIDA AKIO
4 granted patents·192 citations·filing 1995–2000
81Inventor score
Top patents by PatentIndex Score
4 records- 0192US6221814B1Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluidSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 24, 2001·106 cites·10 claims
- 0282US6422067B1Slurry useful for wire-saw slicing and evaluation of slurrySUPER SILICON CRYSTAL RES INST·Filed 2000·Granted Jul 23, 2002·23 cites·1 claims
- 0378US6001265ARecovery of coolant and abrasive grains used in slicing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Dec 14, 1999·48 cites·14 claims
- 0456US5693596ACutting fluid, method for production thereof, and method for cutting ingotSHINETSU HANDOTAI KK·Filed 1995·Granted Dec 2, 1997·15 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Akio Ashida files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →