Inventor · disambiguated record
Akira Chinda
Also filed as: CHINDA AKIRA
12 granted patents·6 pending applications·137 citations·filing 2001–2010
91Inventor score
Top patents by PatentIndex Score
18 records- 0192US7939935B2Electronic device substrate, electronic device and methods for fabricating the sameHITACHI CABLE·Filed 2007·Granted May 10, 2011·25 cites·24 claims
- 0287US7880091B2Electronic device substrate, electronic device and methods for making sameHITACHI CABLE·Filed 2006·Granted Feb 1, 2011·13 cites·4 claims
- 0385US8101864B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodCHINDA AKIRA·Filed 2009·Granted Jan 24, 2012·13 cites·7 claims
- 0484US7681310B2Method for fabricating double-sided wiring boardHITACHI CABLE·Filed 2005·Granted Mar 23, 2010·12 cites·9 claims
- 0584US6670718B2Wiring board utilizing a conductive member having a reduced thicknessHITACHI CABLE·Filed 2001·Granted Dec 30, 2003·34 cites·36 claims
- 0679US7705245B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodHITACHI CABLE·Filed 2006·Granted Apr 27, 2010·8 cites·12 claims
- 0775US8230591B2Method for fabricating an electronic device substrateCHINDA AKIRA·Filed 2008·Granted Jul 31, 2012·6 cites·14 claims
- 0872US7780836B2Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the sameHITACHI CABLE·Filed 2006·Granted Aug 24, 2010·5 cites·8 claims
- 0971US8230588B2Method of making an electronic device and electronic device substrateMIYAMOTO NOBUAKI·Filed 2009·Granted Jul 31, 2012·5 cites·6 claims
- 1057US6969910B2Semiconductor device, wiring board and method of making sameHITACHI CABLE·Filed 2003·Granted Nov 29, 2005·8 cites·9 claims
- 1157US2009057156A1Production method for wiring and viasHITACHI CABLE·Filed 2008·Application pending·0 cites
- 1256US6943100B2Method of fabricating a wiring board utilizing a conductive member having a reduced thicknessHITACHI CABLE·Filed 2003·Granted Sep 13, 2005·6 cites·5 claims
- 1350US2008251387A1Wiring Board and Production Method ThereofHABA TOSHIO·Filed 2008·Application pending·0 cites
- 1447US2006225918A1Electronic device substrate and its fabrication method, and electronic device and its fabrication methodNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1545US2006163725A1Wiring board and production method thereofHABA TOSHIO·Filed 2005·Application pending·0 cites
- 1644US7268408B2Wiring board, method for manufacturing wiring board and electronic component using wiring boardHITACHI CABLE·Filed 2003·Granted Sep 11, 2007·2 cites·16 claims
- 1744US2007287289A1Production method of conductive patternHABA TOSHIO·Filed 2007·Application pending·0 cites
- 1842US2010181100A1Copper circuit wiring board and method for manufacturing the sameHITACHI CABLE·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →