Inventor · disambiguated record
Akio Furusawa
Also filed as: FURUSAWA AKIO
27 granted patents·13 pending applications·85 citations·filing 1996–2025
94Inventor score
Files withPANASONIC IP MAN CO LTD19MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5FURUSAWA AKIO4PANASONIC CORP4NAKAMURA TAICHI3
Top patents by PatentIndex Score
40 records- 0187US8598464B2Soldering material and electronic component assemblySAKATANI SHIGEAKI·Filed 2010·Granted Dec 3, 2013·10 cites·4 claims
- 0278US8810035B2Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure bodyNAKAMURA TAICHI·Filed 2011·Granted Aug 19, 2014·5 cites·4 claims
- 0371US6267823B1Solder, solder paste and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 31, 2001·20 cites·5 claims
- 0471US2025121461A1Bonding material and bonded structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0571US2025282005A1Joining materialPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0668US10493567B2Solder alloy and bonded structure using the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Dec 3, 2019·1 cites·3 claims
- 0767US5962133ASolder, electronic component mounted by soldering, and electronic circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 5, 1999·32 cites·8 claims
- 0866US7973412B2Semiconductor device using lead-free solder as die bonding material and die bonding material not containing leadPANASONIC CORP·Filed 2008·Granted Jul 5, 2011·4 cites·12 claims
- 0962US11318534B2Metal microparticle production method and metal microparticle production devicePANASONIC IP MAN CO LTD·Filed 2019·Granted May 3, 2022·0 cites·7 claims
- 1061US9199340B2Solder material and bonded structurePANASONIC IP MAN CO LTD·Filed 2014·Granted Dec 1, 2015·0 cites·12 claims
- 1161US7176402B2Method and apparatus for processing electronic partsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 13, 2007·8 cites·16 claims
- 1260US2025108463A1Bonding material and bonding structurePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 1358US8227090B2Bonding material, electronic component, bonding structure and electronic deviceFURUSAWA AKIO·Filed 2007·Granted Jul 24, 2012·1 cites·16 claims
- 1458US6428745B2Solder, solder paste and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 6, 2002·4 cites·1 claims
- 1555US10636724B2Mount structurePANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·9 claims
- 1655US2025286009A1Joining structure and joining material for forming joining part of said joining structurePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 1754US9789569B2Solder material and bonded structurePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 17, 2017·0 cites·12 claims
- 1853US11515280B2Mounting structure and nanoparticle mounting materialPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·3 claims
- 1953US9981348B2Solder alloy and mounted structure using samePANASONIC IP MAN CO LTD·Filed 2016·Granted May 29, 2018·0 cites·5 claims
- 2051US11515281B2Bonded structure and bonding materialPANASONIC CORP·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 2151US11135683B2Solder alloy and junction structure using samePANASONIC IP MAN CO LTD·Filed 2018·Granted Oct 5, 2021·0 cites·8 claims
- 2251US10960496B2Solder alloy and package structure using samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 30, 2021·0 cites·5 claims
- 2349US11476399B2Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Oct 18, 2022·0 cites·8 claims
- 2446US8421246B2Joint structure and electronic componentFURUSAWA AKIO·Filed 2009·Granted Apr 16, 2013·0 cites·11 claims
- 2544US10170442B2Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layerPANASONIC IP MAN CO LTD·Filed 2017·Granted Jan 1, 2019·0 cites·6 claims
- 2644US9386699B2Mounted structure and manufacturing method of mounted structureHINE KIYOHIRO·Filed 2011·Granted Jul 5, 2016·0 cites·7 claims
- 2743US2010294550A1Bonding material, electronic component and bonded structureFURUSAWA AKIO·Filed 2008·Application pending·0 cites
- 2842US8268718B2Bonded structure and manufacturing method for bonded structureNAKAMURA TAICHI·Filed 2011·Granted Sep 18, 2012·0 cites·3 claims
- 2941US8552307B2Mounting structureHINE KIYOHIRO·Filed 2011·Granted Oct 8, 2013·0 cites·7 claims
- 3041US2001025875A1Solder, solder paste and soldering methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Application pending·0 cites
- 3140US8338966B2Joint structure, joining material, and method for producing joining material containing bismuthFURUSAWA AKIO·Filed 2010·Granted Dec 25, 2012·0 cites·8 claims
- 3240US2017266767A1Flux for soldering, and soldering paste composition including samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3338US10068869B2Mounting structure and BGA ballPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·2 claims
- 3438US8691377B2Semiconductor deviceNAKAMURA TAICHI·Filed 2010·Granted Apr 8, 2014·0 cites·6 claims
- 3538US2018257179A1Solder alloy and joint structurePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 3637US2010148367A1Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 3737US2011042817A1Solder joint structure, and joining method of the samePANASONIC CORP·Filed 2010·Application pending·0 cites
- 3837US2017282305A1Solder alloy and package structure using samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3937US2018056448A1Liquid dispersion of metal nanoparticles for solder paste, method for producing the liquid dispersion, solder paste, method for producing the solder pasteUNIV TOHOKU·Filed 2016·Application pending·0 cites
- 4037US2012153461A1Semiconductor component, semiconductor wafer component, manufacturing method of semiconductor component, and manufacturing method of joining structureKITAURA HIDETOSHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →