Inventor · disambiguated record
Akito Hirano
Also filed as: HIRANO AKITO
11 granted patents·4 pending applications·23 citations·filing 2005–2023
86Inventor score
Files withHITACHI INT ELECTRIC INC5KOKUSAI ELECTRIC CORP5UEDA TATSUSHI2HIRANO AKITO1HITACHI KOKUSAI ELECTRIC IN1
Top patents by PatentIndex Score
15 records- 0187US9236242B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted Jan 12, 2016·6 cites·13 claims
- 0285US10840094B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Nov 17, 2020·4 cites·19 claims
- 0382US10192735B2Substrate processing method and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2017·Granted Jan 29, 2019·2 cites·15 claims
- 0479US8334215B2Substrate processing method and substrate processing apparatusUEDA TATSUSHI·Filed 2009·Granted Dec 18, 2012·5 cites·15 claims
- 0571US9754780B2Substrate processing method and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 5, 2017·1 cites·13 claims
- 0668US8066894B2Substrate processing method and substrate processing apparatusUEDA TATSUSHI·Filed 2006·Granted Nov 29, 2011·2 cites·11 claims
- 0765US12435439B2Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0863US8133820B2Substrate processing method and substrate processing apparatusHIRANO AKITO·Filed 2006·Granted Mar 13, 2012·3 cites·12 claims
- 0956US2024105465A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1051US2023295837A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1150US10049870B2Method of manufacturing semiconductor device including silicon nitride layer for inhibiting excessive oxidation of polysilicon filmHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 14, 2018·0 cites·9 claims
- 1248US2013078816A1Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording MediumHITACHI INT ELECTRIC INC·Filed 2012·Application pending·0 cites
- 1343US2009233430A1Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, and semiconductor device manufacturing systemHITACHI KOKUSAI ELECTRIC IN·Filed 2009·Application pending·0 cites
- 1442US7795156B2Producing method of semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2005·Granted Sep 14, 2010·0 cites·7 claims
- 1528US8178445B2Substrate processing apparatus and manufacturing method of semiconductor device using plasma generationHORIE TADASHI·Filed 2010·Granted May 15, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →