Inventor · disambiguated record
Akihiro Horibe
Also filed as: HORIBE AKIHIRO
49 granted patents·16 pending applications·365 citations·filing 1998–2025
97Inventor score
Top patents by PatentIndex Score
65 records- 0197US10107966B1Single-mode polymer waveguide connector assemblyIBM·Filed 2017·Granted Oct 23, 2018·37 cites·2 claims
- 0294US9887119B1Multi-chip package assemblyIBM·Filed 2016·Granted Feb 6, 2018·12 cites·6 claims
- 0394US6241358B1Tandem lighting panelNITTO JUSHI KOGYO KABUSHIKI KA·Filed 1999·Granted Jun 5, 2001·182 cites·7 claims
- 0492US11574848B2Underfill injection for electronic devicesIBM·Filed 2021·Granted Feb 7, 2023·2 cites·23 claims
- 0591US7548674B1Alignment method for circular multi-core optical fiberIBM·Filed 2008·Granted Jun 16, 2009·27 cites·1 claims
- 0690US10302868B2Polymer waveguide connector assembly method using cores and cladding that are both partially exposedIBM·Filed 2018·Granted May 28, 2019·1 cites·20 claims
- 0790US10170443B1Debonding chips from waferIBM·Filed 2017·Granted Jan 1, 2019·7 cites·12 claims
- 0886US10460971B2Multi-chip package assemblyIBM·Filed 2017·Granted Oct 29, 2019·4 cites·19 claims
- 0984US11735575B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2021·Granted Aug 22, 2023·1 cites·16 claims
- 1084US11114308B2Controlling of height of high-density interconnection structure on substrateIBM·Filed 2018·Granted Sep 7, 2021·3 cites·24 claims
- 1183US10622311B2High-density interconnecting adhesive tapeIBM·Filed 2017·Granted Apr 14, 2020·3 cites·16 claims
- 1282US11211638B2Large capacity solid state batteryIBM·Filed 2017·Granted Dec 28, 2021·1 cites·8 claims
- 1382US10529665B2High-density interconnecting adhesive tapeIBM·Filed 2017·Granted Jan 7, 2020·3 cites·12 claims
- 1481US6217184B1Light source device with uniformity in color temperature of emissionENPLAS CORP·Filed 1998·Granted Apr 17, 2001·58 cites·4 claims
- 1577US10317625B2Polymer waveguide (PWG) connector assembly having both cores and cladding partially exposedIBM·Filed 2018·Granted Jun 11, 2019·1 cites·20 claims
- 1676US10133003B1Single-mode polymer waveguide connector assemblyIBM·Filed 2017·Granted Nov 20, 2018·1 cites·18 claims
- 1776US9721812B2Optical device with precoated underfillIBM·Filed 2015·Granted Aug 1, 2017·2 cites·16 claims
- 1875US11069917B2Stacked film battery architectureIBM·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 1975US11063288B2Stacked film battery architectureIBM·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 2075US9586281B2Forming a solder joint between metal layersIBM·Filed 2015·Granted Mar 7, 2017·2 cites·12 claims
- 2174US12142603B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2023·Granted Nov 12, 2024·0 cites·8 claims
- 2274US12094825B2Interconnection between chips by bridge chipIBM·Filed 2023·Granted Sep 17, 2024·0 cites·25 claims
- 2371US10388578B2Wafer scale testing and initialization of small die chipsIBM·Filed 2017·Granted Aug 20, 2019·1 cites·10 claims
- 2471US9893031B2Chip mounting structureIBM·Filed 2016·Granted Feb 13, 2018·1 cites·4 claims
- 2570US10325839B2Reduction of stress in via structureIBM·Filed 2017·Granted Jun 18, 2019·1 cites·18 claims
- 2668US12087596B2Controlling of height of high-density interconnection structure on substrateIBM·Filed 2021·Granted Sep 10, 2024·0 cites·18 claims
- 2768US2025259905A1Underfill vacuum processIBM·Filed 2025·Application pending·0 cites
- 2867US10424510B2Solder fill into high aspect through holesIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 2966US12315775B2Underfill vacuum processIBM·Filed 2021·Granted May 27, 2025·0 cites·8 claims
- 3066US10431847B2Stacked film battery architectureIBM·Filed 2016·Granted Oct 1, 2019·0 cites·10 claims
- 3165US11848272B2Interconnection between chips by bridge chipIBM·Filed 2021·Granted Dec 19, 2023·0 cites·9 claims
- 3265US6765634B2Liquid crystal display device and display deviceIBM·Filed 2002·Granted Jul 20, 2004·10 cites·13 claims
- 3364US11637325B2Large capacity solid state batteryIBM·Filed 2017·Granted Apr 25, 2023·0 cites·14 claims
- 3464US10074583B2Circuit module and manufacturing method thereofIBM·Filed 2015·Granted Sep 11, 2018·1 cites·12 claims
- 3564US9466533B2Semiconductor structure including a through electrode, and method for forming the sameIBM·Filed 2015·Granted Oct 11, 2016·1 cites·5 claims
- 3663US10388566B2Solder fill into high aspect through holesIBM·Filed 2016·Granted Aug 20, 2019·0 cites·13 claims
- 3761US2025347860A1Sprit polymer optical waveguide for high density co-package integrationIBM·Filed 2024·Application pending·0 cites
- 3861US2025327967A1Hybrid single mode optical waveguideIBM·Filed 2024·Application pending·0 cites
- 3960US12456656B2Multichip interconnect packageIBM·Filed 2022·Granted Oct 28, 2025·0 cites·22 claims
- 4060US11908723B2Silicon handler with laser-release layersIBM·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 4158US10679912B2Wafer scale testing and initialization of small die chipsIBM·Filed 2017·Granted Jun 9, 2020·0 cites·11 claims
- 4258US10141278B2Chip mounting structureIBM·Filed 2017·Granted Nov 27, 2018·0 cites·7 claims
- 4357US2025048730A1Release layer containing semiconductor-on-insulator substratesIBM·Filed 2023·Application pending·0 cites
- 4456US10679916B2Circuit module and manufacturing method thereofIBM·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 4556US10593616B2Reduction of stress in via structureTESSERA INC·Filed 2017·Granted Mar 17, 2020·0 cites·20 claims
- 4656US2019214339A1Reduction of stress in via structureIBM·Filed 2019·Application pending·0 cites
- 4756US2025006681A1Unified crackstop structure for joining semiconductor buildsIBM·Filed 2023·Application pending·0 cites
- 4855US2019139840A1Wafer scale testing and initialization of small die chipsIBM·Filed 2018·Application pending·0 cites
- 4954US11320419B2Sampling of breath gasIBM·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 5054US11316143B2Stacked device structureIBM·Filed 2019·Granted Apr 26, 2022·0 cites·22 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →