Inventor · disambiguated record
Akihiko Iwaya
Also filed as: IWAYA AKIHIKO
18 granted patents·9 pending applications·548 citations·filing 1991–2025
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0192US6452266B1Semiconductor deviceHITACHI LTD·Filed 2001·Granted Sep 17, 2002·61 cites·1 claims
- 0291US5571428ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1995·Granted Nov 5, 1996·113 cites·3 claims
- 0390US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 0485US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 0576US5437915ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1994·Granted Aug 1, 1995·47 cites·4 claims
- 0674US5252854ASemiconductor device having stacked lead structureHITACHI LTD·Filed 1991·Granted Oct 12, 1993·51 cites·44 claims
- 0767US6617196B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Sep 9, 2003·11 cites·2 claims
- 0866US6388318B1Surface mount-type package of ball grid array with multi-chip mountingHITACHI LTD·Filed 2000·Granted May 14, 2002·11 cites·16 claims
- 0959US6392295B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted May 21, 2002·18 cites·11 claims
- 1059US2025054899A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025062272A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1259US2025054897A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1359US2025022832A1Semiconductor module, semiconductor device, and vehicleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1459US2025022833A1Semiconductor module, semiconductor device, and vehicleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1559US2025062271A1Semiconductor module and method for manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1656US6064112AResin-molded semiconductor device having a lead on chip structureHITACHI LTD·Filed 1998·Granted May 16, 2000·21 cites·13 claims
- 1755US6576994B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Jun 10, 2003·5 cites·7 claims
- 1854US6137159ALead on chip semiconductor device and method of fabricating the sameHITACHI LTD·Filed 1999·Granted Oct 24, 2000·18 cites·33 claims
- 1954US2024021569A1Semiconductor module and method for manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 2053US6545349B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 8, 2003·4 cites·4 claims
- 2150US10020225B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 10, 2018·0 cites·21 claims
- 2250US2025343198A1Semiconductor device having a wiring member with an uneven bonding surfaceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2349US2022278039A1Semiconductor module and method for manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 2448US9805981B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 31, 2017·0 cites·20 claims
- 2548US6335227B1Method of fabricating a lead-on-chip (LOC) semiconductor deviceFiled 2000·Granted Jan 1, 2002·3 cites·8 claims
- 2648US5869888ASemiconductor device with lead structure on principal surface of chipHITACHI LTD·Filed 1996·Granted Feb 9, 1999·12 cites·9 claims
- 2745US6610561B2Method of fabricating a semiconductor deviceHITACHI LTD·Filed 2001·Granted Aug 26, 2003·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →