Inventor · disambiguated record
Akihito Kawai
Also filed as: KAWAI AKIHITO
14 granted patents·8 pending applications·146 citations·filing 2004–2024
86Inventor score
Top patents by PatentIndex Score
22 records- 0194US7129150B2Method of dividing a semiconductor waferDISCO CORP·Filed 2004·Granted Oct 31, 2006·139 cites·5 claims
- 0287US11164802B2Wafer manufacturing method and multilayer device chip manufacturing methodDISCO CORP·Filed 2020·Granted Nov 2, 2021·2 cites·7 claims
- 0386US12383982B2Laminated device wafer forming methodDISCO CORP·Filed 2022·Granted Aug 12, 2025·1 cites·6 claims
- 0471US10658220B2Device transferring methodDISCO CORP·Filed 2019·Granted May 19, 2020·1 cites·4 claims
- 0569US7687375B2Lamination device manufacturing methodDISCO CORP·Filed 2008·Granted Mar 30, 2010·3 cites·4 claims
- 0660US2024387229A1Method of manufacturing laminated assemblyDISCO CORP·Filed 2024·Application pending·0 cites
- 0758US2024177999A1Wafer processing apparatusDISCO CORP·Filed 2023·Application pending·0 cites
- 0855US11764115B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 0954US12300545B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 1054US11854891B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 1154US11764114B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 1254US11756831B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 1352US12322655B2Method of manufacturing layered device chip assemblyDISCO CORP·Filed 2022·Granted Jun 3, 2025·0 cites·3 claims
- 1452US12198990B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Jan 14, 2025·0 cites·12 claims
- 1545US2008076256A1Via hole forming methodDISCO CORP·Filed 2007·Application pending·0 cites
- 1642US7601485B2Exposure methodDISCO CORP·Filed 2006·Granted Oct 13, 2009·0 cites·1 claims
- 1741US2006073705A1Method for dividing semiconductor wafer along streetsDISCO CORP·Filed 2005·Application pending·0 cites
- 1839US2006012056A1Semiconductor chip resin encapsulation methodDISCO CORP·Filed 2005·Application pending·0 cites
- 1939US2006088983A1Method of dividing waferFUJISAWA SHINICHI·Filed 2005·Application pending·0 cites
- 2038US2011256665A1Stacked wafer manufacturing methodDISCO CORP·Filed 2011·Application pending·0 cites
- 2136US8389386B2Stacked wafer manufacturing methodKAWAI AKIHITO·Filed 2011·Granted Mar 5, 2013·0 cites·3 claims
- 2233US2019148132A1Method of manufacturing small-diameter waferDISCO CORP·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akihito Kawai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →