Inventor · disambiguated record
Akiteru Ko
Also filed as: KO AKITERU
57 granted patents·17 pending applications·710 citations·filing 2004–2024
98Inventor score
Top patents by PatentIndex Score
74 records- 0198US9786503B2Method for increasing pattern density in self-aligned patterning schemes without using hard masksTOKYO ELECTRON LTD·Filed 2016·Granted Oct 10, 2017·45 cites·20 claims
- 0298US9570313B2Method for etching high-K dielectric using pulsed bias powerTOKYO ELECTRON LTD·Filed 2015·Granted Feb 14, 2017·42 cites·19 claims
- 0397US10354873B2Organic mandrel protection processTOKYO ELECTRON LTD·Filed 2017·Granted Jul 16, 2019·340 cites·20 claims
- 0497US10290506B2Method for etching high-K dielectric using pulsed bias powerTOKYO ELECTRON LTD·Filed 2017·Granted May 14, 2019·39 cites·23 claims
- 0597US9673059B2Method for increasing pattern density in self-aligned patterning integration schemesTOKYO ELECTRON LTD·Filed 2016·Granted Jun 6, 2017·45 cites·19 claims
- 0697US9159575B2Method for etching high-K dielectric using pulsed bias powerTOKYO ELECTRON LTD·Filed 2014·Granted Oct 13, 2015·37 cites·20 claims
- 0796US8735291B2Method for etching high-k dielectric using pulsed bias powerRANJAN ALOK·Filed 2011·Granted May 27, 2014·39 cites·20 claims
- 0895US9443731B1Material processing to achieve sub-10nm patterningTOKYO ELECTRON LTD·Filed 2015·Granted Sep 13, 2016·21 cites·20 claims
- 0994US9165765B1Method for patterning differing critical dimensions at sub-resolution scalesTOKYO ELECTRON LTD·Filed 2014·Granted Oct 20, 2015·17 cites·20 claims
- 1090US8334083B2Etch process for controlling pattern CD and integrity in multi-layer masksLUONG VINH HOANG·Filed 2011·Granted Dec 18, 2012·16 cites·20 claims
- 1189US11651965B2Method and system for capping of cores for self-aligned multiple patterningTOKYO ELECTRON LTD·Filed 2020·Granted May 16, 2023·2 cites·20 claims
- 1287US9899219B2Trimming inorganic resists with selected etchant gas mixture and modulation of operating variablesTOKYO ELECTRON LTD·Filed 2016·Granted Feb 20, 2018·5 cites·20 claims
- 1382US9812325B2Method for modifying spacer profileTOKYO ELECTRON LTD·Filed 2016·Granted Nov 7, 2017·3 cites·12 claims
- 1482US8945408B2Etch process for reducing directed self assembly pattern defectivityTOKYO ELECTRON LTD·Filed 2013·Granted Feb 3, 2015·6 cites·21 claims
- 1581US9257280B2Mitigation of asymmetrical profile in self aligned patterning etchTOKYO ELECTRON LTD·Filed 2014·Granted Feb 9, 2016·5 cites·13 claims
- 1680US11424123B2Forming a semiconductor feature using atomic layer etchTOKYO ELECTRON LTD·Filed 2020·Granted Aug 23, 2022·1 cites·20 claims
- 1779US10260150B2Method and system for sculpting spacer sidewall maskTOKYO ELECTRON LTD·Filed 2018·Granted Apr 16, 2019·2 cites·16 claims
- 1878US10217670B2Wrap-around contact integration schemeTOKYO ELECTRON LTD·Filed 2017·Granted Feb 26, 2019·2 cites·20 claims
- 1978US8268184B2Etch process for reducing silicon recessKO AKITERU·Filed 2010·Granted Sep 18, 2012·6 cites·20 claims
- 2078US8236700B2Method for patterning an ARC layer using SF6 and a hydrocarbon gasCOLE CHRISTOPHER·Filed 2009·Granted Aug 7, 2012·8 cites·19 claims
- 2178US7888267B2Method for etching silicon-containing ARC layer with reduced CD biasTOKYO ELECTRON LTD·Filed 2008·Granted Feb 15, 2011·7 cites·20 claims
- 2273US8980111B2Sidewall image transfer method for low aspect ratio patternsTOKYO ELECTRON LTD·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
- 2372US11551930B2Methods to reshape spacer profiles in self-aligned multiple patterningTOKYO ELECTRON LTD·Filed 2019·Granted Jan 10, 2023·1 cites·25 claims
- 2472US10950442B2Methods to reshape spacers for multi-patterning processes using thermal decomposition materialsTOKYO ELECTRON LTD·Filed 2019·Granted Mar 16, 2021·1 cites·17 claims
- 2571US10978300B2Methods to reduce gouging for core removal processes using thermal decomposition materialsTOKYO ELECTRON LTD·Filed 2019·Granted Apr 13, 2021·1 cites·19 claims
- 2671US9520270B2Direct current superposition curing for resist reflow temperature enhancementTOKYO ELECTRON LTD·Filed 2014·Granted Dec 13, 2016·2 cites·12 claims
- 2770US10861739B2Method of patterning low-k materials using thermal decomposition materialsTOKYO ELECTRON LTD·Filed 2019·Granted Dec 8, 2020·1 cites·20 claims
- 2869US7531461B2Process and system for etching doped silicon using SF6-based chemistryTOKYO ELECTRON LTD·Filed 2005·Granted May 12, 2009·3 cites·16 claims
- 2968US9153457B2Etch process for reducing directed self assembly pattern defectivity using direct current positioningTOKYO ELECTRON LTD·Filed 2013·Granted Oct 6, 2015·2 cites·19 claims
- 3067US7743731B2Reduced contaminant gas injection system and method of usingTOKYO ELECTRON LTD·Filed 2006·Granted Jun 29, 2010·3 cites·16 claims
- 3166US8501628B2Differential metal gate etching processLUONG VINH HOANG·Filed 2010·Granted Aug 6, 2013·2 cites·20 claims
- 3261US12272559B2Oblique deposition and etch processesTOKYO ELECTRON LTD·Filed 2022·Granted Apr 8, 2025·0 cites·25 claims
- 3360US2025118532A1System and method for plasma processingTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3459US12332568B2Metal oxide resists for EUV patterning and methods for developing the sameTOKYO ELECTRON LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 3559US12287578B2Cyclic method for reactive development of photoresistsTOKYO ELECTRON LTD·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 3658US2025293012A1System and method for semiconductor processingTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3757US2025264430A1Apparatus and method for plasma measurementTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 3855US11615958B2Methods to reduce microbridge defects in EUV patterning for microelectronic workpiecesTOKYO ELECTRON LTD·Filed 2020·Granted Mar 28, 2023·0 cites·24 claims
- 3954US11372332B2Plasma treatment method to improve photo resist roughness and remove photo resist scumTOKYO ELECTRON LTD·Filed 2019·Granted Jun 28, 2022·0 cites·8 claims
- 4054US2024266149A1Methods for Semiconductor Process ChamberTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4154US2024339309A1Advanced OES CharacterizationTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4253US2025138429A1Endpoint detection in dry development of photoresistTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 4351US11626271B2Surface fluorination remediation for aluminium oxide electrostatic chucksTOKYO ELECTRON LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 4451US10734228B2Manufacturing methods to apply stress engineering to self-aligned multi-patterning (SAMP) processesTOKYO ELECTRON LTD·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 4550US10790154B2Method of line cut by multi-color patterning techniqueTOKYO ELECTRON LTD·Filed 2019·Granted Sep 29, 2020·0 cites·21 claims
- 4650US2009151870A1Silicon carbide focus ring for plasma etching systemTOKYO ELECTRON LTD·Filed 2007·Application pending·0 cites
- 4749US11676817B2Method for pitch split patterning using sidewall image transferTOKYO ELECTRON LTD·Filed 2020·Granted Jun 13, 2023·0 cites·17 claims
- 4848US11515160B2Substrate processing method using multiline patterningTOKYO ELECTRON LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 4948US8313661B2Deep trench liner removal processLUONG VINH·Filed 2009·Granted Nov 20, 2012·0 cites·20 claims
- 5047US11417526B2Multiple patterning processesTOKYO ELECTRON LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →