Inventor · disambiguated record
Akira Morozumi
Also filed as: MOROZUMI AKIRA
23 granted patents·7 pending applications·281 citations·filing 1996–2023
95Inventor score
Files withFUJI ELECTRIC CO LTD16FUJI ELEC DEVICE TECH CO LTD4GOHARA HIROMICHI4FUJI ELECTRIC SYSTEMS CO LTD2HONDA MOTOR CO LTD1
Top patents by PatentIndex Score
30 records- 0191US8933557B2Semiconductor module and cooling unitGOHARA HIROMICHI·Filed 2010·Granted Jan 13, 2015·17 cites·12 claims
- 0291US8450845B2Semiconductor deviceIKEDA YOSHINARI·Filed 2009·Granted May 28, 2013·29 cites·4 claims
- 0390US9237676B2Semiconductor module cooler and semiconductor moduleGOHARA HIROMICHI·Filed 2012·Granted Jan 12, 2016·13 cites·15 claims
- 0490US8902589B2Semiconductor module and coolerGOHARA HIROMICHI·Filed 2011·Granted Dec 2, 2014·13 cites·22 claims
- 0590US6690087B2Power semiconductor module ceramic substrate with upper and lower plates attached to a metal baseFUJI ELECTRIC CO LTD·Filed 2001·Granted Feb 10, 2004·50 cites·10 claims
- 0689US9245821B2Cooling device for semiconductor module, and semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2012·Granted Jan 26, 2016·9 cites·19 claims
- 0788US9673130B2Semiconductor device having a coolerFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 6, 2017·6 cites·16 claims
- 0886US6844621B2Semiconductor device and method of relaxing thermal stressFUJI ELECTRIC CO LTD·Filed 2003·Granted Jan 18, 2005·50 cites·13 claims
- 0980US10128167B2Semiconductor module and manufacturing method of semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2017·Granted Nov 13, 2018·3 cites·18 claims
- 1073US7781258B2Manufacturing method of semiconductor deviceFUJI ELECTRIC SYSTEMS CO LTD·Filed 2009·Granted Aug 24, 2010·6 cites·16 claims
- 1172US9179578B2Semiconductor module and heat radiation memberSOYANO SHIN·Filed 2010·Granted Nov 3, 2015·3 cites·8 claims
- 1269US8673691B2Method for manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Mar 18, 2014·2 cites·6 claims
- 1368US9269644B2Method for producing semiconductor deviceNISHIMURA YOSHITAKA·Filed 2013·Granted Feb 23, 2016·2 cites·16 claims
- 1468US9263367B2Semiconductor deviceHONDA MOTOR CO LTD·Filed 2014·Granted Feb 16, 2016·2 cites·19 claims
- 1563US10461012B2Semiconductor module with reinforcing boardFUJI ELECTRIC CO LTD·Filed 2016·Granted Oct 29, 2019·1 cites·13 claims
- 1663US5869890AInsulation substrate for a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 1997·Granted Feb 9, 1999·29 cites·13 claims
- 1762US9293391B2Semiconductor module cooler and semiconductor moduleGOHARA HIROMICHI·Filed 2012·Granted Mar 22, 2016·1 cites·10 claims
- 1860US5675181AZirconia-added alumina substrate with direct bonding of copperFUJI ELECTRIC CO LTD·Filed 1996·Granted Oct 7, 1997·32 cites·14 claims
- 1959US7816249B2Method for producing a semiconductor device using a solder alloyFUJI ELECTRIC SYSTEMS CO LTD·Filed 2008·Granted Oct 19, 2010·1 cites·9 claims
- 2057US12512388B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·17 claims
- 2157US6905063B2Method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2003·Granted Jun 14, 2005·7 cites·26 claims
- 2257US2023420318A1Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2023·Application pending·0 cites
- 2356US2006157862A1Semiconductor device and method for producing the sameFUJI ELEC DEVICE TECH CO LTD·Filed 2006·Application pending·0 cites
- 2455US7514785B2Semiconductor device and manufacturing method thereofFUJI ELEC DEVICE TECH CO LTD·Filed 2006·Granted Apr 7, 2009·1 cites·8 claims
- 2554US6914325B2Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2003·Granted Jul 5, 2005·4 cites·4 claims
- 2654US2009166851A1Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2009·Application pending·0 cites
- 2748US2005218426A1Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2005·Application pending·0 cites
- 2847US2009289344A1Semiconductor deviceFUJI ELEC DEVICE TECH CO LTD·Filed 2009·Application pending·0 cites
- 2945US2015008574A1Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Application pending·0 cites
- 3042US2006263235A1Solder alloy and a semiconductor device using the solder alloyFUJI ELEC DEVICE TECH CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →