Inventor · disambiguated record
Akio Nakamura
Also filed as: ISIZUKA HIROSI · NAKAMURA AKIO · SADO RYOICHI
125 granted patents·9 pending applications·2,487 citations·filing 1976–2019
99Inventor score
Files withOKI ELECTRIC IND CO LTD25FUJITSU COMPONENT LTD20SHINETSU HANDOTAI KK11SHINETSU POLYMER CO10JTEKT CORP7
Top patents by PatentIndex Score
134 records- 0198US6937124B1Plane plate vibration device and switch employing the sameFUJITSU COMPONENT LTD·Filed 2005·Granted Aug 30, 2005·92 cites·24 claims
- 0298US5621982AElectronic substrate processing system using portable closed containers and its equipmentsSHINKO ELECTRIC CO LTD·Filed 1994·Granted Apr 22, 1997·605 cites·8 claims
- 0395US4163204APressure-sensitive resistorsSHINETSU POLYMER CO·Filed 1978·Granted Jul 31, 1979·67 cites·2 claims
- 0494US9929417B2Valve deviceJTEKT CORP·Filed 2015·Granted Mar 27, 2018·6 cites·4 claims
- 0593US5986333ASemiconductor apparatus and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 1997·Granted Nov 16, 1999·136 cites·25 claims
- 0692US9927817B2Throttle valveJTEKT CORP·Filed 2015·Granted Mar 27, 2018·7 cites·3 claims
- 0789US10428962B2Valve deviceJTEKT CORP·Filed 2017·Granted Oct 1, 2019·6 cites·9 claims
- 0889US7459777B2Semiconductor package containing multi-layered semiconductor chipsOKI ELECTRIC IND CO LTD·Filed 2006·Granted Dec 2, 2008·17 cites·11 claims
- 0989US4917466AMethod for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected therebySHINETSU POLYMER CO·Filed 1988·Granted Apr 17, 1990·87 cites·5 claims
- 1088US3998513AMulti-contact interconnectorsSHINETSU POLYMER CO LTD·Filed 1976·Granted Dec 21, 1976·66 cites·9 claims
- 1187US9670879B2Valve apparatusJTEKT CORP·Filed 2015·Granted Jun 6, 2017·6 cites·8 claims
- 1287US9336975B2Power distribution apparatus supplying direct-current powerFUJITSU COMPONENT LTD·Filed 2012·Granted May 10, 2016·7 cites·5 claims
- 1387US9217760B2Current sensorFUJITSU COMPONENT LTD·Filed 2013·Granted Dec 22, 2015·6 cites·18 claims
- 1487US8739657B2Wire stripperKOMAX HOLDING AG·Filed 2013·Granted Jun 3, 2014·12 cites·10 claims
- 1587US7579205B2Method of fabricating light emitting device and thus-fabricated light emitting deviceSHINETSU HANDOTAI KK·Filed 2005·Granted Aug 25, 2009·18 cites·9 claims
- 1686US8692634B2Switch device and connectorYUBA TAKASHI·Filed 2012·Granted Apr 8, 2014·6 cites·12 claims
- 1786US5746008AElectronic substrate processing system using portable closed containersSHINKO ELECTRIC CO LTD·Filed 1997·Granted May 5, 1998·87 cites·9 claims
- 1886US5363867AArticle storage house in a clean roomSHINKO ELECTRIC CO LTD·Filed 1993·Granted Nov 15, 1994·98 cites·21 claims
- 1986US4201435AInterconnectorsSHINETSU POLYMER CO·Filed 1978·Granted May 6, 1980·42 cites·1 claims
- 2085US9995406B2Valve deviceJTEKT CORP·Filed 2015·Granted Jun 12, 2018·4 cites·3 claims
- 2185USD585467SThrowaway insert for a pin mirror cutterSUMITOMO ELEC HARDMETAL CORP·Filed 2008·Granted Jan 27, 2009·26 cites·1 claims
- 2285US7267007B2Acceleration sensing deviceOKI ELECTRIC IND CO LTD·Filed 2005·Granted Sep 11, 2007·10 cites·15 claims
- 2385US6340842B1Semiconductor device in a recess of a semiconductor plateOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jan 22, 2002·60 cites·4 claims
- 2485US4210895APressure sensitive resistor elementsSHINETSU POLYMER CO·Filed 1978·Granted Jul 1, 1980·27 cites·3 claims
- 2584US7245048B2Tactile panelFUJITSU COMPONENT LTD·Filed 2005·Granted Jul 17, 2007·13 cites·13 claims
- 2683US5041183AMethod for the preparation of a hot-melt adhesive interconnectorSHINETSU POLYMER CO·Filed 1990·Granted Aug 20, 1991·69 cites·6 claims
- 2782US6764254B2Throwaway insert and pin mirror cutter using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Jul 20, 2004·27 cites·6 claims
- 2881US8841572B2Switch device and connectorIWAMOTO DAIEI·Filed 2012·Granted Sep 23, 2014·5 cites·11 claims
- 2981US8664553B2Switch device and connectorYUBA TAKASHI·Filed 2012·Granted Mar 4, 2014·5 cites·11 claims
- 3081US8573993B2ConnectorBEAK SEUNGSEOK·Filed 2012·Granted Nov 5, 2013·5 cites·9 claims
- 3181USD589542SThrowaway insert for a pin mirror cutterSUMITOMO ELEC HARDMETAL CORP·Filed 2008·Granted Mar 31, 2009·21 cites·1 claims
- 3281US6476505B2Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip cornersOKI ELECTRIC IND CO LTD·Filed 2001·Granted Nov 5, 2002·27 cites·21 claims
- 3381US4203088APressure-sensitive multiple resistor elementsSHINETSU POLYMER CO·Filed 1978·Granted May 13, 1980·24 cites·2 claims
- 3480US7443384B2Coordinates input deviceFUJITSU COMPONENT LTD·Filed 2004·Granted Oct 28, 2008·28 cites·24 claims
- 3580US6960972B2High-frequency relay having a conductive and grounding base covering at least a bottom surface of a bodyFUJITSU COMPONENT LTD·Filed 2002·Granted Nov 1, 2005·23 cites·33 claims
- 3680US6538322B2Semiconductor device in a recess of a semiconductor plateOKI ELECTRIC IND CO LTD·Filed 2001·Granted Mar 25, 2003·22 cites·10 claims
- 3779US4177141AFilter medium, process for preparation thereof, filtering method and filtering apparatusISIZUKA HIROSI·Filed 1978·Granted Dec 4, 1979·35 cites·7 claims
- 3875US7880382B2Organic electroluminescence panel and manufacturing method of the sameTOPPAN PRINTING CO LTD·Filed 2007·Granted Feb 1, 2011·4 cites·19 claims
- 3975US7524004B2Movable console deviceFUJITSU COMPONENT LTD·Filed 2006·Granted Apr 28, 2009·8 cites·14 claims
- 4075US5270507APush button switch and method for manufacturing sameSHINETSU POLYMER CO·Filed 1991·Granted Dec 14, 1993·30 cites·32 claims
- 4175US4584034AIron-base amorphous alloys having improved fatigue and toughness characteristicsUNITIKA LTD·Filed 1984·Granted Apr 22, 1986·22 cites·21 claims
- 4274US7242395B2Input device and driving device thereofFUJITSU COMPONENT LTD·Filed 2003·Granted Jul 10, 2007·19 cites·25 claims
- 4374US6281591B1Semiconductor apparatus and semiconductor apparatus manufacturing methodOKI ELECTRIC IND CO LTD·Filed 2000·Granted Aug 28, 2001·16 cites·7 claims
- 4474US5614146AMethod and apparatus of supplying labels to injection moldSUMITOMO HEAVY INDUSTRIES·Filed 1995·Granted Mar 25, 1997·46 cites·2 claims
- 4573US6863044B2Air intake device of internal combustion engineNISSAN MOTOR·Filed 2003·Granted Mar 8, 2005·16 cites·24 claims
- 4673US6797881B2Cross substrate, method of mounting semiconductor element, and semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Sep 28, 2004·14 cites·13 claims
- 4773US6770543B2Semiconductor apparatus and semiconductor apparatus manufacturing methodOKI ELECTRIC IND CO LTD·Filed 2001·Granted Aug 3, 2004·15 cites·6 claims
- 4873US6307271B1Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip cornersOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 23, 2001·17 cites·5 claims
- 4971US6977428B2Semiconductor device adapted to remove noise from a signalOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 20, 2005·14 cites·9 claims
- 5070US9568114B2Valve unit comprising a check valve deviceJTEKT CORP·Filed 2014·Granted Feb 14, 2017·3 cites·8 claims
Showing the top 50 of 134 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →