Inventor · disambiguated record
Akihito Nishibayashi
Also filed as: NISHIBAYASHI AKIHITO
7 granted patents·21 citations·filing 1999–2020
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0186US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 0276US8102061B2Semiconductor device bonding wire and wire bonding methodUNO TOMOHIRO·Filed 2008·Granted Jan 24, 2012·6 cites·10 claims
- 0368US8247911B2Wire bonding structure and method for forming sameUNO TOMOHIRO·Filed 2008·Granted Aug 21, 2012·4 cites·26 claims
- 0455US12388044B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·4 claims
- 0555US12132025B2Bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·4 claims
- 0650US9112059B2Bonding wire for semiconductor deviceUNO TOMOHIRO·Filed 2012·Granted Aug 18, 2015·0 cites·21 claims
- 0735US6294411B1Method for molding a semiconductor device utilizing a satin finishNIPPON STEEL SEMICONDUCTOR·Filed 1999·Granted Sep 25, 2001·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →