Inventor · disambiguated record
Akira Owatari
Also filed as: OWATARI AKIRA
13 granted patents·12 pending applications·81 citations·filing 2002–2021
89Inventor score
Top patents by PatentIndex Score
25 records- 0192US7285492B2Method for processing substrateEBARA CORP·Filed 2005·Granted Oct 23, 2007·21 cites·9 claims
- 0287US7442257B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2006·Granted Oct 28, 2008·9 cites·3 claims
- 0386US7575636B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2006·Granted Aug 18, 2009·8 cites·13 claims
- 0485US7087117B2Substrate processing apparatus and substrate processing methodEBARA CORP·Filed 2003·Granted Aug 8, 2006·23 cites·5 claims
- 0577US11566339B2Plating method and plating apparatusEBARA CORP·Filed 2021·Granted Jan 31, 2023·0 cites·3 claims
- 0676US9708724B2Anode unit and plating apparatus having such anode unitEBARA CORP·Filed 2015·Granted Jul 18, 2017·1 cites·13 claims
- 0772US6824613B2Substrate processing apparatusEBARA CORP·Filed 2002·Granted Nov 30, 2004·16 cites·11 claims
- 0865US7498261B2Method and apparatus for forming metal filmEBARA CORP·Filed 2005·Granted Mar 3, 2009·3 cites·6 claims
- 0959US10941504B2Plating method and plating apparatusEBARA CORP·Filed 2019·Granted Mar 9, 2021·0 cites·9 claims
- 1054US2008176008A1Apparatus and method for forming magnetic filmWANG XINMING·Filed 2008·Application pending·0 cites
- 1153US2019211468A1Plating methodEBARA CORP·Filed 2019·Application pending·0 cites
- 1252US12157951B2Plating method, insoluble anode for plating, and plating apparatusEBARA CORP·Filed 2020·Granted Dec 3, 2024·0 cites·7 claims
- 1352US2008000776A1Method and apparatus for processing substrateWANG XINMING·Filed 2007·Application pending·0 cites
- 1451US2006243204A1Substrate processing apparatus and substrate processing methodKATSUOKA SEIJI·Filed 2006·Application pending·0 cites
- 1550US7878144B2Electroless plating apparatus and electroless plating methodEBARA CORP·Filed 2006·Granted Feb 1, 2011·0 cites·10 claims
- 1649US10294580B2Plating method and plating apparatusEBARA CORP·Filed 2015·Granted May 21, 2019·0 cites·18 claims
- 1749US2010075498A1Semiconductor device and method for manufacturing the same, and processing liquidTAKAGI DAISUKE·Filed 2009·Application pending·0 cites
- 1848US10294581B2Plating methodEBARA CORP·Filed 2015·Granted May 21, 2019·0 cites·5 claims
- 1945US2010105154A1Method and apparatus for processing substrateWANG XINMING·Filed 2010·Application pending·0 cites
- 2043US2005022909A1Substrate processing method and substrate processing apparatusFiled 2004·Application pending·0 cites
- 2143US2008067679A1Semiconductor Device and Method for Manufacturing the Same, and Processing LiquidTAKAGI DAISUKE·Filed 2005·Application pending·0 cites
- 2242US2007224811A1Substrate processing method and substrate processing apparatusWANG XINMING·Filed 2007·Application pending·0 cites
- 2342US2014299476A1Electroplating methodEBARA CORP·Filed 2014·Application pending·0 cites
- 2440US2005208774A1Wet processing method and processing apparatus of substrateFUKUNAGA AKIRA·Filed 2005·Application pending·0 cites
- 2536US2008138508A1Substrate Processing Method and Substrate Processing ApparatusTAKAGI DAISUKE·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →