Inventor · disambiguated record
Akihisa Sai
Also filed as: SAI AKIHISA
6 granted patents·2 pending applications·81 citations·filing 2017–2023
80Inventor score
Files withSANDISK TECHNOLOGIES LLC8
Top patents by PatentIndex Score
8 records- 0196US10297610B2Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2017·Granted May 21, 2019·26 cites·6 claims
- 0295US10672780B1Three-dimensional memory device having dual configuration support pillar structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jun 2, 2020·44 cites·20 claims
- 0392US10381229B2Three-dimensional memory device with straddling drain select electrode lines and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Aug 13, 2019·9 cites·12 claims
- 0477US11121149B2Three-dimensional memory device containing direct contact drain-select-level semiconductor channel portions and methods of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Sep 14, 2021·2 cites·11 claims
- 0558US2024179907A1Three-dimensional memory device containing etch stop structures for word line contacts and methods of employing the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 0658US2024121959A1Multi-tier memory device with different width central staircase regions in different vertical tiers and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2023·Application pending·0 cites
- 0753US12178040B2Three-dimensional memory device with doped semiconductor bridge structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Dec 24, 2024·0 cites·13 claims
- 0852US12225720B2Three-dimensional memory device with doped semiconductor bridge structures and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Feb 11, 2025·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →