Inventor · disambiguated record
Akinobu Shibuya
Also filed as: SHIBUYA AKINOBU
19 granted patents·13 pending applications·436 citations·filing 1994–2024
95Inventor score
Top patents by PatentIndex Score
32 records- 0194US6524905B2Semiconductor device, and thin film capacitorNEC CORP·Filed 2001·Granted Feb 25, 2003·76 cites·7 claims
- 0292US6818469B2Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the sameNEC CORP·Filed 2003·Granted Nov 16, 2004·71 cites·35 claims
- 0390US6515324B2Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing sameNEC CORP·Filed 2001·Granted Feb 4, 2003·59 cites·22 claims
- 0488US10544363B2Ceramic emitterNEC CORP·Filed 2015·Granted Jan 28, 2020·3 cites·6 claims
- 0585US6278153B1Thin film capacitor formed in viaNEC CORP·Filed 1999·Granted Aug 21, 2001·62 cites·30 claims
- 0684US6703705B2Semiconductor device and method for packaging sameNEC CORP·Filed 2001·Granted Mar 9, 2004·31 cites·19 claims
- 0779US8802496B2Substrate for semiconductor package and method of manufacturing thereofSHIBUYA AKINOBU·Filed 2013·Granted Aug 12, 2014·5 cites·3 claims
- 0879US8237292B2Semiconductor device and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2008·Granted Aug 7, 2012·8 cites·8 claims
- 0978US10908078B2Monitoring method, monitoring system, and structure, construction, or movable bodyNEC CORP·Filed 2017·Granted Feb 2, 2021·1 cites·20 claims
- 1076US6466124B1Thin film resistor and method for forming the sameNEC CORP·Filed 2000·Granted Oct 15, 2002·24 cites·15 claims
- 1169US5576518AVia-structure of a multilayer interconnection ceramic substrateNEC CORP·Filed 1995·Granted Nov 19, 1996·37 cites·20 claims
- 1267US2024158255A1Ceramic sintered body, infrared stealth material, and method for manufacturing ceramic sintered bodyNEC CORP·Filed 2023·Application pending·0 cites
- 1365US8531023B2Substrate for semiconductor package and method of manufacturing thereofSHIBUYA AKINOBU·Filed 2010·Granted Sep 10, 2013·2 cites·11 claims
- 1464US2023267901A1Signal generation device, electronic musical instrument, electronic keyboard device, electronic apparatus, and signal generation methodYAMAHA CORP·Filed 2023·Application pending·0 cites
- 1561US2024410759A1Composite material, bolometer, and composite material forming methodNEC CORP·Filed 2024·Application pending·0 cites
- 1660US8669138B2Semiconductor device and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2012·Granted Mar 11, 2014·1 cites·14 claims
- 1756US6331811B2Thin-film resistor, wiring substrate, and method for manufacturing the sameNEC CORP·Filed 1999·Granted Dec 18, 2001·15 cites·18 claims
- 1855US11326071B2Coating material and solidified body of coating materialNEC CORP·Filed 2017·Granted May 10, 2022·0 cites·11 claims
- 1954US2025286497A1Ceramic film, method for manufacturing the same, emitter, and thermophotovoltaic power generation deviceNEC CORP·Filed 2023·Application pending·0 cites
- 2053US6949815B2Semiconductor device with decoupling capacitors mounted on conductorsNEC CORP·Filed 2003·Granted Sep 27, 2005·4 cites·3 claims
- 2151US2014068905A1Capacitor producing method, capacitor producing device, and capacitor producing programSHIBUYA AKINOBU·Filed 2013·Application pending·0 cites
- 2251US2023077215A1Sintered body having pores and method for producing the sameNEC CORP·Filed 2022·Application pending·0 cites
- 2349US8621730B2Capacitor producing method for producing thin-film capacitors eliminating defectsSHIBUYA AKINOBU·Filed 2010·Granted Jan 7, 2014·0 cites·8 claims
- 2449US6618694B1Method, apparatus and computer program product for forming data to be analyzed by finite element method and calculation method based on finite element methodNEC CORP·Filed 1998·Granted Sep 9, 2003·28 cites·3 claims
- 2548US2010044089A1Interposer integrated with capacitors and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2008·Application pending·0 cites
- 2642US2015034373A1Wiring structure and manufacturing method thereofNAKASHIMA YOSHIKI·Filed 2013·Application pending·0 cites
- 2740US2013012145A1Radio module and manufacturing method thereforNEC CORP·Filed 2011·Application pending·0 cites
- 2840US2002030577A1Thin-film resistor, wiring substrate, and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 2940US2002020836A1Thin film capacitor avoiding short circuit between electrodesNEC CORP·Filed 2001·Application pending·0 cites
- 3039US5485352AElement joining pad for semiconductor device mounting boardNEC CORP·Filed 1994·Granted Jan 16, 1996·9 cites·9 claims
- 3136US2002017700A1Multilayer capacitor, semiconductor device, and electrical circuit boardNEC CORP·Filed 2001·Application pending·0 cites
- 3235US2022229215A1Radiation suppression film and radiation suppression structureNEC CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →