Inventor · disambiguated record
Akinori Shindo
Also filed as: SHINDO AKINORI
8 granted patents·4 pending applications·25 citations·filing 2004–2013
82Inventor score
Top patents by PatentIndex Score
12 records- 0177US7476968B2Semiconductor device including an under electrode and a bump electrodeSEIKO EPSON CORP·Filed 2006·Granted Jan 13, 2009·8 cites·5 claims
- 0273US8631701B2Sensor device, motion sensor, and electronic deviceCHIBA SEIICHI·Filed 2011·Granted Jan 21, 2014·7 cites·19 claims
- 0367US7649260B2Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Jan 19, 2010·4 cites·29 claims
- 0460US7598569B2Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Oct 6, 2009·2 cites·4 claims
- 0559US7514790B2Semiconductor device and method of manufacturing a semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Apr 7, 2009·2 cites·5 claims
- 0655US7638886B2Semiconductor device and semiconductor chipSEIKO EPSON CORP·Filed 2006·Granted Dec 29, 2009·1 cites·1 claims
- 0751US8749001B2Electronic component, electronic device, and method of manufacturing the electronic componentHANAOKA TERUNAO·Filed 2011·Granted Jun 10, 2014·1 cites·14 claims
- 0850US7777334B2Semiconductor device having active element formation region provided under a bump padSEIKO EPSON CORP·Filed 2008·Granted Aug 17, 2010·0 cites·5 claims
- 0948US2014103467A1Sensor device, motion sensor, and electronic deviceSEIKO EPSON CORP·Filed 2013·Application pending·0 cites
- 1046US2007007662A1Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 1139US2007023825A1Semiconductor deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 1238US2005116340A1Semiconductor device and method of manufacturing the sameSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →