Inventor · disambiguated record
Akihito Takano
Also filed as: TAKANO AKIHITO
12 granted patents·3 pending applications·197 citations·filing 2000–2013
91Inventor score
Top patents by PatentIndex Score
15 records- 0194US7319049B2Method of manufacturing an electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 15, 2008·40 cites·19 claims
- 0292US6498714B1Thin film capacitance device and printed circuit boardSHINKO ELECTRIC IND CO·Filed 2000·Granted Dec 24, 2002·72 cites·13 claims
- 0381US6891732B2Multilayer circuit board and semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 2002·Granted May 10, 2005·27 cites·18 claims
- 0477US8669643B2Wiring board, semiconductor device, and method for manufacturing wiring boardTAKANO AKIHITO·Filed 2012·Granted Mar 11, 2014·5 cites·11 claims
- 0576US8058717B2Laminated body of semiconductor chips including pads mutually connected to conductive memberTAKANO AKIHITO·Filed 2010·Granted Nov 15, 2011·5 cites·7 claims
- 0675US8446013B2Wiring substrate and method for manufacturing the wiring substrateSUNOHARA MASAHIRO·Filed 2011·Granted May 21, 2013·4 cites·18 claims
- 0774US6754952B2Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporatedSHINKO ELECTRIC IND CO·Filed 2002·Granted Jun 29, 2004·21 cites·6 claims
- 0873US8810007B2Wiring board, semiconductor device, and method for manufacturing wiring boardTAKANO AKIHITO·Filed 2012·Granted Aug 19, 2014·4 cites·12 claims
- 0972US7358591B2Capacitor device and semiconductor device having the same, and capacitor device manufacturing methodSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 15, 2008·5 cites·9 claims
- 1063US8766101B2Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrateMIYAIRI KEN·Filed 2012·Granted Jul 1, 2014·3 cites·15 claims
- 1161US7161242B2Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor elementSHINKO ELECTRIC IND CO·Filed 2004·Granted Jan 9, 2007·10 cites·18 claims
- 1256US8101461B2Stacked semiconductor device and method of manufacturing the sameTAKANO AKIHITO·Filed 2009·Granted Jan 24, 2012·1 cites·11 claims
- 1342US2014151891A1Semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Application pending·0 cites
- 1440US2006017133A1Electronic part-containing elements, electronic devices and production methodsSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 1534US2003094686A1Semiconductor device and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →