Inventor · disambiguated record
Akihiko Tateiwa
Also filed as: TATEIWA AKIHIKO
25 granted patents·3 pending applications·230 citations·filing 2003–2022
95Inventor score
Top patents by PatentIndex Score
28 records- 0197US8941230B2Semiconductor package and manufacturing methodSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 27, 2015·79 cites·5 claims
- 0296US8120166B2Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 21, 2012·68 cites·9 claims
- 0390US8786103B2Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layerUCHIYAMA KENTA·Filed 2010·Granted Jul 22, 2014·13 cites·8 claims
- 0487US8994193B2Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Mar 31, 2015·9 cites·11 claims
- 0585US8169072B2Semiconductor device, manufacturing method thereof, and electronic deviceUCHIYAMA KENTA·Filed 2010·Granted May 1, 2012·9 cites·6 claims
- 0683US9515050B2Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor componentsSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 6, 2016·6 cites·10 claims
- 0777US7939377B1Method of manufacturing semiconductor element mounted wiring boardSHINKO ELECTRIC IND CO·Filed 2010·Granted May 10, 2011·5 cites·8 claims
- 0876US8530753B2Fine wiring package and method of manufacturing the sameKUNIMOTO YUJI·Filed 2009·Granted Sep 10, 2013·8 cites·4 claims
- 0974US9299678B2Semiconductor package and manufacturing method thereforKYOZUKA MASAHIRO·Filed 2011·Granted Mar 29, 2016·5 cites·9 claims
- 1073US9142524B2Semiconductor package and method for manufacturing semiconductor packageKYOZUKA MASAHIRO·Filed 2012·Granted Sep 22, 2015·4 cites·20 claims
- 1173US8111954B2Module substrate including optical transmission mechanism and method of producing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 7, 2012·6 cites·12 claims
- 1270US8017503B2Manufacturing method of semiconductor packageSHINKO ELECTRIC IND CO·Filed 2010·Granted Sep 13, 2011·3 cites·10 claims
- 1368US8901725B2Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the sameTATEIWA AKIHIKO·Filed 2011·Granted Dec 2, 2014·4 cites·6 claims
- 1466US8436471B2Semiconductor package with its surface edge covered by resinCHINO TERUAKI·Filed 2010·Granted May 7, 2013·2 cites·7 claims
- 1565US8399977B2Resin-sealed package and method of producing the sameKUNIMOTO YUJI·Filed 2009·Granted Mar 19, 2013·3 cites·8 claims
- 1664US9078384B2Wiring substrate and method of manufacturing the sameFURUICHI JUN·Filed 2012·Granted Jul 7, 2015·2 cites·8 claims
- 1759US11881794B2Electrostatic adsorption member and substrate fixing deviceSHINKO ELECTRIC IND CO·Filed 2022·Granted Jan 23, 2024·0 cites·11 claims
- 1854US8314347B2Wiring board with lead pins and method of producing the sameUCHIYAMA KENTA·Filed 2009·Granted Nov 20, 2012·0 cites·13 claims
- 1952US2009073525A1Display deviceSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 2049US9386695B2Wiring substrate having multiple core substratesSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 5, 2016·0 cites·6 claims
- 2149US7133589B2Tape fiber and method for treating sameSHINKO ELECTRIC IND CO·Filed 2003·Granted Nov 7, 2006·2 cites·10 claims
- 2249US7016574B2Optical collimator structureSHINKO ELECTRIC IND CO·Filed 2004·Granted Mar 21, 2006·2 cites·11 claims
- 2347US7963031B2Package for semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 21, 2011·0 cites·5 claims
- 2444US9054082B2Semiconductor package, semiconductor device, and method for manufacturing semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 9, 2015·0 cites·10 claims
- 2541US8659127B2Wiring substrate, semiconductor device and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2012·Granted Feb 25, 2014·0 cites·11 claims
- 2641US2005089272A1Optical fiber collimator and manufacturing method thereofFiled 2004·Application pending·0 cites
- 2736US2011062578A1Semiconductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 2826US8153479B2Method of manufacturing semiconductor packageHIZUME TOHRU·Filed 2010·Granted Apr 10, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →