Inventor · disambiguated record
Akihisa Uchida
Also filed as: UCHIDA AKIHISA
22 granted patents·2 pending applications·339 citations·filing 1984–2015
96Inventor score
Top patents by PatentIndex Score
24 records- 0188US4949162ASemiconductor integrated circuit with dummy pedestalsHITACHI LTD·Filed 1988·Granted Aug 14, 1990·91 cites·21 claims
- 0277US7073147B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Jul 4, 2006·17 cites·16 claims
- 0375US4746963AIsolation regions formed by locos followed with groove etch and refillHITACHI LTD·Filed 1986·Granted May 24, 1988·33 cites·42 claims
- 0464US5011788AProcess of manufacturing semiconductor integrated circuit device and product formed therebyHITACHI LTD·Filed 1988·Granted Apr 30, 1991·22 cites·21 claims
- 0559US4907063ASemiconductor body, and device formed therefrom, having grooves with silicon nitride on the groove surfacesHITACHI LTD·Filed 1987·Granted Mar 6, 1990·21 cites·38 claims
- 0658US9252793B2Semiconductor deviceTSUTSUMI TOSHIAKI·Filed 2010·Granted Feb 2, 2016·1 cites·16 claims
- 0758US5351211ASemiconductor integrated circuit device having circuit inspection functionHITACHI LTD·Filed 1993·Granted Sep 27, 1994·22 cites·20 claims
- 0858US4819054ASemiconductor IC with dual groove isolationHITACHI LTD·Filed 1987·Granted Apr 4, 1989·18 cites·30 claims
- 0951US5141888AProcess of manufacturing semiconductor integrated circuit device having trench and field isolation regionsHITACHI LTD·Filed 1991·Granted Aug 25, 1992·15 cites·37 claims
- 1050US2008258177A1method of manufacturing a semiconductor device and a semiconductor deviceIKEDA HIROYUKI·Filed 2008·Application pending·0 cites
- 1149US5388073ASemiconductor integrated circuit device and digital processor employing the sameHITACHI LTD·Filed 1991·Granted Feb 7, 1995·15 cites·19 claims
- 1248US9503018B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·0 cites·17 claims
- 1347US4926378ABipolar static RAM having two wiring lines for each word lineHITACHI LTD·Filed 1988·Granted May 15, 1990·9 cites·22 claims
- 1446US2006214721A1Method of manufacturing a semiconductor device and a semiconductor deviceIKEDA HIROYUKI·Filed 2006·Application pending·0 cites
- 1544US5214302ASemiconductor integrated circuit device forming on a common substrate MISFETs isolated by a field oxide and bipolar transistors isolated by a grooveHITACHI LTD·Filed 1991·Granted May 25, 1993·10 cites·24 claims
- 1643US4853343AMethod for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refillHITACHI LTD·Filed 1988·Granted Aug 1, 1989·8 cites·20 claims
- 1742US5029127ABipolar SRAM having word lines as vertically stacked pairs of conductive lines parallelly formed with holding current linesHITACHI LTD·Filed 1990·Granted Jul 2, 1991·8 cites·16 claims
- 1842US4809052ASemiconductor memory deviceHITACHI LTD·Filed 1986·Granted Feb 28, 1989·7 cites·17 claims
- 1942US4700464AMethod of forming trench isolation in an integrated circuitHITACHI LTD·Filed 1984·Granted Oct 20, 1987·8 cites·20 claims
- 2041US5200348AMethod of manufacturing semiconductor device with constant width deep groove isolationHITACHI LTD·Filed 1991·Granted Apr 6, 1993·8 cites·16 claims
- 2141US5177584ASemiconductor integrated circuit device having bipolar memory, and method of manufacturing the sameHITACHI LTD·Filed 1991·Granted Jan 5, 1993·8 cites·7 claims
- 2238US5084402AMethod of fabricating a semiconductor substrate, and semiconductor device, having thick oxide films and groove isolationHITACHI IND·Filed 1989·Granted Jan 28, 1992·8 cites·29 claims
- 2336US4926235ASemiconductor deviceTAMAKI YOICHI·Filed 1987·Granted May 15, 1990·8 cites·30 claims
- 2431US5128740ASemiconductor integrated circuit device with isolation grooves and protruding portionsHITACHI LTD·Filed 1989·Granted Jul 7, 1992·2 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →