Inventor · disambiguated record
Akira Yoshio
Also filed as: YOSHIO AKIRA
14 granted patents·7 pending applications·488 citations·filing 1978–2006
94Inventor score
Files withSONY CORP13YOSHIO AKIRA2MATSUSHITA ELECTRIC WORKS LTD1SEGAWA YUJI1SONY DISC TECHNOLOGY INC1
Top patents by PatentIndex Score
21 records- 0197US6693036B1Method for producing semiconductor device polishing apparatus, and polishing methodSONY CORP·Filed 2000·Granted Feb 17, 2004·121 cites·18 claims
- 0291US6555158B1Method and apparatus for plating, and plating structureSONY CORP·Filed 2000·Granted Apr 29, 2003·64 cites·30 claims
- 0389US6638564B2Method of electroless plating and electroless plating apparatusSONY CORP·Filed 2001·Granted Oct 28, 2003·46 cites·49 claims
- 0486US6534117B1Electroless plating method and electroless plating solutionSONY CORP·Filed 2000·Granted Mar 18, 2003·32 cites·8 claims
- 0585US6797623B2Methods of producing and polishing semiconductor device and polishing apparatusSONY CORP·Filed 2001·Granted Sep 28, 2004·30 cites·26 claims
- 0682US6808617B2Electrolytic polishing methodSONY CORP·Filed 2001·Granted Oct 26, 2004·21 cites·49 claims
- 0782US6380065B1Interconnection structure and fabrication process thereforSONY CORP·Filed 1999·Granted Apr 30, 2002·69 cites·8 claims
- 0882US4188240AMethod for producing a metal layer by platingSONY CORP·Filed 1978·Granted Feb 12, 1980·21 cites·6 claims
- 0973US7186322B2Methods of producing and polishing semiconductor device and polishing apparatusSONY CORP·Filed 2002·Granted Mar 6, 2007·14 cites·42 claims
- 1067US5591264ASpin coating deviceSONY CORP·Filed 1995·Granted Jan 7, 1997·23 cites·18 claims
- 1165US5778911ALiquid supplying apparatusSONY DISC TECHNOLOGY INC·Filed 1995·Granted Jul 14, 1998·32 cites·14 claims
- 1256US4387356ACircuit breakerMATSUSHITA ELECTRIC WORKS LTD·Filed 1981·Granted Jun 7, 1983·10 cites·10 claims
- 1354US2008220136A1Method for Producing Dried Foods to be Eaten After Cooked or Reconstituted with Hot Water, and Dried NoodlesYAMADAI CORP·Filed 2004·Application pending·0 cites
- 1453US7232760B2Method for producing semiconductor device, polishing apparatus, and polishing methodSONY CORP·Filed 2004·Granted Jun 19, 2007·3 cites·30 claims
- 1553US2007051632A1Polishing method, polishing apparatus, plating method, and plating apparatusSONY CORP·Filed 2006·Application pending·0 cites
- 1650US2005112548A1Unit for detecting interaction between substances utilizing capillarity, and method and bioassay substrate using the detecting unitFiled 2004·Application pending·0 cites
- 1750US2007284247A1Bioassay Substrate With Feeder WiringsYOSHIO AKIRA·Filed 2004·Application pending·0 cites
- 1848US2007077644A1Bioassay substrate with feeder wiringsYOSHIO AKIRA·Filed 2004·Application pending·0 cites
- 1947US6855634B2Polishing method and polishing apparatusSONY CORP·Filed 2001·Granted Feb 15, 2005·2 cites·14 claims
- 2043US2004182720A1Polishing method, polishing apparatus, plating method, and plating apparatusFiled 2004·Application pending·0 cites
- 2138US2006127904A1Hybridization sensing part, sensor chip, and hybridization methodSEGAWA YUJI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →