Inventor · disambiguated record
Alan J. Jensen
Also filed as: JENSEN ALAN · JENSEN ALAN J · JENSEN ALAN JOHN
19 granted patents·4 pending applications·456 citations·filing 1996–2023
95Inventor score
Top patents by PatentIndex Score
23 records- 0198US9779956B1Hydrogen activated atomic layer etchingLAM RES CORP·Filed 2017·Granted Oct 3, 2017·109 cites·18 claims
- 0297US11848212B2Alternating etch and passivation processLAM RES CORP·Filed 2022·Granted Dec 19, 2023·10 cites·14 claims
- 0397US11551938B2Alternating etch and passivation processLAM RES CORP·Filed 2020·Granted Jan 10, 2023·13 cites·21 claims
- 0496US12293919B2Alternating etch and passivation processLAM RES CORP·Filed 2023·Granted May 6, 2025·3 cites·15 claims
- 0593US6585579B2Chemical mechanical planarization or polishing pad with sections having varied groove patternsLAM RES CORP·Filed 2001·Granted Jul 1, 2003·61 cites·16 claims
- 0688US6261168B1Chemical mechanical planarization or polishing pad with sections having varied groove patternsLAM RES CORP·Filed 1999·Granted Jul 17, 2001·89 cites·20 claims
- 0784US8906810B2Pulsed dielectric etch process for in-situ metal hard mask shape control to enable void-free metallizationLAM RES CORP·Filed 2013·Granted Dec 9, 2014·7 cites·17 claims
- 0884US6315634B1Method of optimizing chemical mechanical planarization processLAM RES CORP·Filed 2000·Granted Nov 13, 2001·31 cites·20 claims
- 0978US6769970B1Fluid venting platen for optimizing wafer polishingLAM RES CORP·Filed 2002·Granted Aug 3, 2004·19 cites·30 claims
- 1069US6645052B2Method and apparatus for controlling CMP pad surface finishLAM RES CORP·Filed 2001·Granted Nov 11, 2003·12 cites·26 claims
- 1168US10134600B2Dielectric contact etchLAM RES CORP·Filed 2017·Granted Nov 20, 2018·1 cites·20 claims
- 1265US6875091B2Method and apparatus for conditioning a polishing pad with sonic energyLAM RES CORP·Filed 2001·Granted Apr 5, 2005·12 cites·31 claims
- 1363US5862560ARoller with treading and system including the sameONTRAK SYSTEMS INC·Filed 1996·Granted Jan 26, 1999·27 cites·18 claims
- 1462US6634936B2Chemical mechanical planarization or polishing pad with sections having varied groove patternsLAM RES CORP·Filed 2001·Granted Oct 21, 2003·7 cites·16 claims
- 1562US6059889AMethod for processing a substrate using a system having a roller with treadingONTRAK SYSTEMS INC·Filed 1999·Granted May 9, 2000·25 cites·5 claims
- 1660US7479457B2Gas mixture for removing photoresist and post etch residue from low-k dielectric material and method of use thereofLAM RES CORP·Filed 2005·Granted Jan 20, 2009·1 cites·14 claims
- 1757US6752698B1Method and apparatus for conditioning fixed-abrasive polishing padsLAM RES CORP·Filed 2002·Granted Jun 22, 2004·8 cites·20 claims
- 1854US6939207B2Method and apparatus for controlling CMP pad surface finishLAM RES CORP·Filed 2003·Granted Sep 6, 2005·5 cites·17 claims
- 1949US2024036474A1Control of metallic contamination from metal-containing photoresistLAM RES CORP·Filed 2022·Application pending·0 cites
- 2047US2024192590A1Apparatus and process for euv dry resist sensitization by gas phase infusion of a sensitizerLAM RES CORP·Filed 2021·Application pending·0 cites
- 2147US2009291562A1Helium descummingLAM RES CORP·Filed 2008·Application pending·0 cites
- 2242US5784787ASheet metal penetrating toolFiled 1997·Granted Jul 28, 1998·16 cites·10 claims
- 2332US2011223770A1Nitride plasma etch with highly tunable selectivity to oxideLAM RES CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →