Inventor · disambiguated record
Alexander Komposch
Also filed as: KOMPOSCH ALEXANDER
38 granted patents·10 pending applications·68 citations·filing 2006–2024
96Inventor score
Files withWOLFSPEED INC21CREE INC12MACOM TECH SOLUTIONS HOLDINGS INC6INFINEON TECHNOLOGIES AG5INFINEON TECHNOLOGIES CORP1
Top patents by PatentIndex Score
48 records- 0196US11533024B2Multi-zone radio frequency transistor amplifiersWOLFSPEED INC·Filed 2020·Granted Dec 20, 2022·5 cites·22 claims
- 0290US8907467B2PCB based RF-power package window frameKOMPOSCH ALEXANDER·Filed 2012·Granted Dec 9, 2014·20 cites·29 claims
- 0386US11830810B2Packaged transistor having die attach materials with channels and process of implementing the sameWOLFSPEED INC·Filed 2020·Granted Nov 28, 2023·2 cites·22 claims
- 0486US11367696B2Radio frequency amplifiers having improved shunt matching circuitsWOLFSPEED INC·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0586US11289378B2Methods for dicing semiconductor wafers and semiconductor devices made by the methodsCREE INC·Filed 2019·Granted Mar 29, 2022·4 cites·23 claims
- 0685US11257740B2Device carrier configured for interconnects, a package implementing a device carrier having interconnects, and processes of making the sameCREE INC·Filed 2020·Granted Feb 22, 2022·2 cites·27 claims
- 0784US8013429B2Air cavity package with copper heat sink and ceramic window frameINFINEON TECHNOLOGIES AG·Filed 2009·Granted Sep 6, 2011·16 cites·15 claims
- 0880US11356070B2RF amplifiers having shielded transmission line structuresWOLFSPEED INC·Filed 2020·Granted Jun 7, 2022·1 cites·20 claims
- 0979US11488923B2High reliability semiconductor devices and methods of fabricating the sameCREE INC·Filed 2019·Granted Nov 1, 2022·2 cites·33 claims
- 1077US11424177B2Integrated circuit having die attach materials with channels and process of implementing the sameCREE INC·Filed 2020·Granted Aug 23, 2022·1 cites·34 claims
- 1176US12100630B2Packaged RF power device with PCB routing outside protective memberMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2020·Granted Sep 24, 2024·1 cites·32 claims
- 1275US12451413B2Packaged semiconductor devices with leadframes having tie bar with recessed cavityMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 1375US10468399B2Multi-cavity package having single metal flangeCREE INC·Filed 2015·Granted Nov 5, 2019·2 cites·5 claims
- 1475US9293407B2Semiconductor package having a baseplate with a die attach region and a peripheral regionINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 22, 2016·3 cites·20 claims
- 1572US11437362B2Multi-cavity package having single metal flangeWOLFSPEED INC·Filed 2019·Granted Sep 6, 2022·1 cites·19 claims
- 1669US12034419B2RF amplifiers having shielded transmission line structuresMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Jul 9, 2024·0 cites·17 claims
- 1768US2022352141A1Multi-Cavity Package Having Single Metal FlangeWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 1867US12080660B2Package with different types of semiconductor dies attached to a flangeCREE INC·Filed 2021·Granted Sep 3, 2024·0 cites·26 claims
- 1967US8314487B2Flange for semiconductor dieMOHAMMED ANWAR A·Filed 2009·Granted Nov 20, 2012·4 cites·18 claims
- 2066US12470185B2Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the sameWOLFSPEED INC·Filed 2022·Granted Nov 11, 2025·0 cites·31 claims
- 2166US12051669B2Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloysWOLFSPEED INC·Filed 2021·Granted Jul 30, 2024·0 cites·33 claims
- 2266US2023019230A1High reliability semiconductor devices and methods of fabricating the sameWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2365US11688673B2Integrated passive device (IPD) components and a package and processes implementing the sameWOLFSPEED INC·Filed 2021·Granted Jun 27, 2023·0 cites·23 claims
- 2464US12009286B2Methods of forming packaged semiconductor devices and leadframes for semiconductor device packagesMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2021·Granted Jun 11, 2024·0 cites·15 claims
- 2562US9997476B2Multi-die package having different types of semiconductor dies attached to the same thermally conductive flangeINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 12, 2018·1 cites·12 claims
- 2660US12500562B2RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnectionsMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2022·Granted Dec 16, 2025·0 cites·24 claims
- 2759US12392821B2Thermal and electrical conductivity between metal contacts utilizing spring pin connectorsWOLFSPEED INC·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 2857US8324115B2Semiconductor chip, semiconductor device and methods for producing the sameOTREMBA RALF·Filed 2006·Granted Dec 4, 2012·1 cites·27 claims
- 2956US11837457B2Packaging for RF transistor amplifiersCREE INC·Filed 2020·Granted Dec 5, 2023·0 cites·24 claims
- 3056US2024079320A1Packaged transistor with channeled die attach materials and process of implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 3155US11581859B2Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurationsCREE INC·Filed 2020·Granted Feb 14, 2023·0 cites·41 claims
- 3255US2023327624A1Rf amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packagingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 3354US11152325B2Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloysCREE INC·Filed 2019·Granted Oct 19, 2021·0 cites·17 claims
- 3454US11004808B2Package with different types of semiconductor dies attached to a flangeCREE INC·Filed 2018·Granted May 11, 2021·0 cites·22 claims
- 3554US2024105692A1Packaged flip chip radio frequency transistor amplifier circuitsWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 3653US11935879B2Integrated passive device (IPD) components and a package and processes implementing the sameCREE INC·Filed 2021·Granted Mar 19, 2024·0 cites·56 claims
- 3752US11670605B2RF amplifier devices including interconnect structures and methods of manufacturingWOLFSPEED INC·Filed 2020·Granted Jun 6, 2023·0 cites·21 claims
- 3852US2024421053A1Packaged device having an integrated passive device with wafer level formed connection to at least one semiconductor device and processes for implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 3951US12166003B2RF amplifier devices including top side contacts and methods of manufacturingMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2020·Granted Dec 10, 2024·0 cites·18 claims
- 4051US12119239B2Packaged semiconductor devices, and package molds for forming packaged semiconductor devicesWOLFSPEED INC·Filed 2021·Granted Oct 15, 2024·0 cites·12 claims
- 4151US2024105570A1Transistor package and process of implementing the transistor packageWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4251US2023253359A1Semiconductor die including a metal stackWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4350US2023402360A1Power package having connected components and processes implementing the sameWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4450US2023420430A1Modular power transistor component assemblies with flip chip interconnectionsWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 4549US11430744B2Die-attach method to compensate for thermal expansionCREE INC·Filed 2017·Granted Aug 30, 2022·0 cites·20 claims
- 4649US8604609B2Flange for semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 10, 2013·0 cites·12 claims
- 4741US9373577B2Hybrid semiconductor packageINFINEON TECHNOLOGIES CORP·Filed 2013·Granted Jun 21, 2016·0 cites·22 claims
- 4838US9209116B1Semiconductor device package having asymmetric chip mounting area and lead widthsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 8, 2015·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →