Inventor · disambiguated record
Alan F. Morrison
Also filed as: MORRISON ALAN · MORRISON ALAN F · MORRISON ALAN FERRIS
16 granted patents·2 pending applications·2,719 citations·filing 1993–2013
97Inventor score
Top patents by PatentIndex Score
18 records- 0199US5516367AChemical vapor deposition chamber with a purge guideAPPLIED MATERIALS INC·Filed 1994·Granted May 14, 1996·397 cites·47 claims
- 0298US5856240AChemical vapor deposition of a thin film onto a substrateAPPLIED MATERIALS INC·Filed 1994·Granted Jan 5, 1999·275 cites·18 claims
- 0398US5766365ARemovable ring for controlling edge deposition in substrate processing apparatusAPPLIED MATERIALS INC·Filed 1995·Granted Jun 16, 1998·435 cites·16 claims
- 0497US5888304AHeater with shadow ring and purge above wafer surfaceAPPLIED MATERIALS INC·Filed 1996·Granted Mar 30, 1999·374 cites·28 claims
- 0597US5855687ASubstrate support shield in wafer processing reactorsAPPLIED MATERIALS INC·Filed 1994·Granted Jan 5, 1999·360 cites·11 claims
- 0694US5688331AResistance heated stem mounted aluminum susceptor assemblyAPPLIED MATERISLS INC·Filed 1996·Granted Nov 18, 1997·411 cites·9 claims
- 0792US5695568AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1994·Granted Dec 9, 1997·95 cites·22 claims
- 0889US6103014AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Aug 15, 2000·62 cites·15 claims
- 0989US5935338AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1996·Granted Aug 10, 1999·63 cites·11 claims
- 1085US5882419AChemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 1997·Granted Mar 16, 1999·46 cites·20 claims
- 1179US5421401ACompound clamp ring for semiconductor wafersAPPLIED MATERIALS INC·Filed 1994·Granted Jun 6, 1995·69 cites·8 claims
- 1275US5332443ALift fingers for substrate processing apparatusAPPLIED MATERIALS INC·Filed 1993·Granted Jul 26, 1994·62 cites·20 claims
- 1368US6155198AApparatus for constructing an oxidized film on a semiconductor waferAPPLIED MATERIALS INC·Filed 1996·Granted Dec 5, 2000·29 cites·15 claims
- 1467US6270621B1Etch chamberAPPLIED MATERIALS INC·Filed 2000·Granted Aug 7, 2001·9 cites·3 claims
- 1556US6123864AEtch chamberAPPLIED MATERIALS INC·Filed 1994·Granted Sep 26, 2000·21 cites·18 claims
- 1647US6699530B2Method for constructing a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 1997·Granted Mar 2, 2004·11 cites·10 claims
- 1742US2004099215A1Chamber for constructing a film on a semiconductor waferAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1840US2015303345A1Amplified detector formed by low temperature direct wafer bondingUNIV COLLEGE CORK NAT UNIV IE·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →