Inventor · disambiguated record
Alexander Veytser
Also filed as: VEYTSER ALEXANDER · VEYTSER ALEXANDER M
32 granted patents·7 pending applications·1,617 citations·filing 1996–2022
98Inventor score
Files withAPPLIED MATERIALS INC16COMPONENT RE ENG COMPANY INC8COMPONENT RE ENGINEERING COMPANY INC4WATLOW ELECTRIC MFG4COMPONENT RE ENGINEERING COMPA2
Top patents by PatentIndex Score
39 records- 0197US6310755B1Electrostatic chuck having gas cavity and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 30, 2001·325 cites·38 claims
- 0297US6108189AElectrostatic chuck having improved gas conduitsAPPLIED MATERIALS INC·Filed 1997·Granted Aug 22, 2000·255 cites·64 claims
- 0396US6721162B2Electrostatic chuck having composite dielectric layer and method of manufactureAPPLIED MATERIALS INC·Filed 2002·Granted Apr 13, 2004·76 cites·20 claims
- 0496US6538872B1Electrostatic chuck having heater and methodAPPLIED MATERIALS INC·Filed 2001·Granted Mar 25, 2003·123 cites·18 claims
- 0596US6478924B1Plasma chamber support having dual electrodesAPPLIED MATERIALS INC·Filed 2000·Granted Nov 12, 2002·124 cites·42 claims
- 0694US6490146B2Electrostatic chuck bonded to base with a bond layer and methodAPPLIED MATERIALS INC·Filed 2001·Granted Dec 3, 2002·88 cites·28 claims
- 0794US6414834B1Dielectric covered electrostatic chuckAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·56 cites·34 claims
- 0893US6503368B1Substrate support having bonded sections and methodAPPLIED MATERIALS INC·Filed 2000·Granted Jan 7, 2003·76 cites·22 claims
- 0993US6494958B1Plasma chamber support with coupled electrodeAPPLIED MATERIALS INC·Filed 2000·Granted Dec 17, 2002·74 cites·20 claims
- 1091US6583980B1Substrate support tolerant to thermal expansion stressesAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·60 cites·44 claims
- 1189US11712745B2Semiconductor substrate support with multiple electrodes and method for making sameWATLOW ELECTRIC MFG·Filed 2022·Granted Aug 1, 2023·1 cites·14 claims
- 1288US6094334APolymer chuck with heater and method of manufactureAPPLIED MATERIALS INC·Filed 1999·Granted Jul 25, 2000·97 cites·58 claims
- 1387US7098428B1System and method for an improved susceptorELLIOT BRENT·Filed 2005·Granted Aug 29, 2006·20 cites·20 claims
- 1486US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 1586US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 1685US6151203AConnectors for an electrostatic chuck and combination thereofAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·76 cites·20 claims
- 1783US6462928B1Electrostatic chuck having improved electrical connector and methodAPPLIED MATERIALS INC·Filed 1999·Granted Oct 8, 2002·65 cites·13 claims
- 1882US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesWATLOW ELECTRIC MFG·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 1977US8932690B2Plate and shaft deviceELLIOT ALFRED GRANT·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 2077US5801915AElectrostatic chuck having a unidirectionally conducting coupler layerAPPLIED MATERIALS INC·Filed 1997·Granted Sep 1, 1998·49 cites·14 claims
- 2174US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 2270US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 2369US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 2469US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 2567US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 2665US5885469ATopographical structure of an electrostatic chuck and method of fabricating sameAPPLIED MATERIALS INC·Filed 1996·Granted Mar 23, 1999·29 cites·22 claims
- 2761US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 2857US11823890B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2957US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 3055US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 3154US11495450B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 8, 2022·0 cites·16 claims
- 3248US9999947B2Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Jun 19, 2018·0 cites·22 claims
- 3348US2019366459A1Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 3447US2007169703A1Advanced ceramic heater for substrate processingELLIOT BRENT·Filed 2006·Application pending·0 cites
- 3547US2010177454A1Electrostatic chuck with dielectric insertsCOMPONENT RE ENGINEERING COMPA·Filed 2009·Application pending·0 cites
- 3646US2008314320A1Chamber Mount for High Temperature Application of AIN HeatersCOMPONENT RE ENGINEERING COMPA·Filed 2008·Application pending·0 cites
- 3744US2004190215A1Electrostatic chuck having dielectric member with stacked layers and manufactureAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3843US2014014710A1Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized RegionsCOMPONENT RE ENGINEERING COMPNAY INC·Filed 2013·Application pending·0 cites
- 3930US2002036881A1Electrostatic chuck having composite base and methodFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →