Inventor · disambiguated record
Amruthavalli Alur
Also filed as: ALUR AMRUTHAVALLI · ALUR AMRUTHAVALLI P · ALUR AMRUTHAVALLI PALLA
1 granted patent·4 pending applications·0 citations·filing 2013–2025
8Inventor score
Top patents by PatentIndex Score
5 records- 0194US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0276US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0346US2015255411A1Die-to-die bonding and associated package configurationsKARHADE OMKAR G·Filed 2014·Application pending·0 cites
- 0442US2014376195A1Methods of forming dual sided coreless package structures with land side capacitorZHANG QINGLEI·Filed 2013·Application pending·0 cites
- 0540US10553453B2Systems and methods for semiconductor packages using photoimageable layersINTEL CORP·Filed 2016·Granted Feb 4, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →