Inventor · disambiguated record
Amir Avishai
Also filed as: AVISHAI AMIR
6 granted patents·7 pending applications·0 citations·filing 2021–2025
65Inventor score
Files withZEISS CARL SMT GMBH13
Top patents by PatentIndex Score
13 records- 0180US12293895B2Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methodsZEISS CARL SMT GMBH·Filed 2023·Granted May 6, 2025·0 cites·21 claims
- 0278US2024328970A1Method of 3d volume inspection of semiconductor wafers with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 0368US11810749B2Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methodsZEISS CARL SMT GMBH·Filed 2021·Granted Nov 7, 2023·0 cites·33 claims
- 0468US2025239474A1Contact area size determination between 3d structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0567US12283504B2Contact area size determination between 3D structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0665US11915908B2Method for measuring a sample and microscope implementing the methodZEISS CARL SMT GMBH·Filed 2021·Granted Feb 27, 2024·0 cites·21 claims
- 0763US2023196189A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2022·Application pending·0 cites
- 0860US11848172B2Method for measuring a sample and microscope implementing the methodZEISS CARL SMT GMBH·Filed 2021·Granted Dec 19, 2023·0 cites·25 claims
- 0958US2024331179A13d volume inspection of semiconductor wafers with increased accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1057US2024311698A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1153US2023267627A1Transferring alignment information in 3d tomography from a first set of images to a second set of imagesZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 1251US12288705B2FIB-SEM 3D tomography for measuring shape deviations of HAR structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 1346US2022138973A1Cross section imaging with improved 3d volume image reconstruction accuracyZEISS CARL SMT GMBH·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →