Inventor · disambiguated record
Ameet Bhansali
Also filed as: BHANSALI AMEET · BHANSALI AMEET S
8 granted patents·387 citations·filing 1993–1997
91Inventor score
Files withINTEL CORP8
Top patents by PatentIndex Score
8 records- 0188US5757071AC4 substrate contact pad which has a layer of Ni-B platingINTEL CORP·Filed 1996·Granted May 26, 1998·92 cites·8 claims
- 0285US5786630AMulti-layer C4 flip-chip substrateINTEL CORP·Filed 1996·Granted Jul 28, 1998·86 cites·20 claims
- 0374US5708296APower-ground plane for a C4 flip-chip substrateINTEL CORP·Filed 1996·Granted Jan 13, 1998·42 cites·14 claims
- 0472US5842626AMethod for coupling surface mounted capacitors to semiconductor packagesINTEL CORP·Filed 1997·Granted Dec 1, 1998·36 cites·32 claims
- 0569US5567981ABonding pad structure having an interposed rigid layerINTEL CORP·Filed 1993·Granted Oct 22, 1996·40 cites·30 claims
- 0667US5893725AC4 substrate contact pad which has a layer of NI-B platingINTEL CORP·Filed 1997·Granted Apr 13, 1999·30 cites·5 claims
- 0766US6265300B1Wire bonding surface and bonding methodINTEL CORP·Filed 1993·Granted Jul 24, 2001·35 cites·23 claims
- 0863US5886406APower-ground plane for a C4 flip-chip substrateINTEL CORP·Filed 1997·Granted Mar 23, 1999·26 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →