Inventor · disambiguated record
Amit Khandelwal
Also filed as: KHANDELWAL AMIT
19 granted patents·4 pending applications·646 citations·filing 2004–2013
95Inventor score
Top patents by PatentIndex Score
23 records- 0197US7405158B2Methods for depositing tungsten layers employing atomic layer deposition techniquesAPPLIED MATERIALS INC·Filed 2005·Granted Jul 29, 2008·105 cites·29 claims
- 0296US7745333B2Methods for depositing tungsten layers employing atomic layer deposition techniquesAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·47 cites·15 claims
- 0396US7691442B2Ruthenium or cobalt as an underlayer for tungsten film depositionAPPLIED MATERIALS INC·Filed 2008·Granted Apr 6, 2010·39 cites·25 claims
- 0496US7429402B2Ruthenium as an underlayer for tungsten film depositionAPPLIED MATERIALS INC·Filed 2004·Granted Sep 30, 2008·101 cites·28 claims
- 0595US7964505B2Atomic layer deposition of tungsten materialsAPPLIED MATERIALS INC·Filed 2008·Granted Jun 21, 2011·166 cites·24 claims
- 0695US7514353B2Contact metallization scheme using a barrier layer over a silicide layerAPPLIED MATERIALS INC·Filed 2006·Granted Apr 7, 2009·37 cites·33 claims
- 0794US7732327B2Vapor deposition of tungsten materialsAPPLIED MATERIALS INC·Filed 2008·Granted Jun 8, 2010·58 cites·25 claims
- 0892US8187970B2Process for forming cobalt and cobalt silicide materials in tungsten contact applicationsGANGULI SESHADRI·Filed 2010·Granted May 29, 2012·12 cites·9 claims
- 0992US8071478B2Method of depositing tungsten film with reduced resistivity and improved surface morphologyWU KAI·Filed 2009·Granted Dec 6, 2011·39 cites·23 claims
- 1091US8563424B2Process for forming cobalt and cobalt silicide materials in tungsten contact applicationsGANGULI SESHADRI·Filed 2012·Granted Oct 22, 2013·10 cites·20 claims
- 1188US7521379B2Deposition and densification process for titanium nitride barrier layersAPPLIED MATERIALS INC·Filed 2007·Granted Apr 21, 2009·11 cites·9 claims
- 1285US8920564B2Methods and apparatus for thermal based substrate processing with variable temperature capabilityTZU GWO-CHUAN·Filed 2011·Granted Dec 30, 2014·4 cites·12 claims
- 1379US7838441B2Deposition and densification process for titanium nitride barrier layersAPPLIED MATERIALS INC·Filed 2009·Granted Nov 23, 2010·5 cites·15 claims
- 1475US9783889B2Apparatus for variable substrate temperature controlTZU GWO-CHUAN·Filed 2012·Granted Oct 10, 2017·1 cites·20 claims
- 1573US8551880B2Ammonia-based plasma treatment for metal fill in narrow featuresMEBARKI BENCHERKI·Filed 2008·Granted Oct 8, 2013·5 cites·23 claims
- 1672US8513116B2Atomic layer deposition of tungsten materialsKHANDELWAL AMIT·Filed 2012·Granted Aug 20, 2013·2 cites·20 claims
- 1771US8211799B2Atomic layer deposition of tungsten materialsKHANDELWAL AMIT·Filed 2011·Granted Jul 3, 2012·2 cites·22 claims
- 1867US9275865B2Plasma treatment of film for impurity removalAPPLIED MATERIALS INC·Filed 2013·Granted Mar 1, 2016·2 cites·18 claims
- 1957US9546419B2Method of reducing tungsten film roughness and resistivityAPPLIED MATERIALS INC·Filed 2013·Granted Jan 17, 2017·0 cites·20 claims
- 2055US2009004850A1Process for forming cobalt and cobalt silicide materials in tungsten contact applicationsGANGULI SESHADRI·Filed 2008·Application pending·0 cites
- 2141US2014273451A1Tungsten deposition sequenceAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2241US2008268635A1Process for forming cobalt and cobalt silicide materials in copper contact applicationsYU SANG-HO·Filed 2008·Application pending·0 cites
- 2333US2012003833A1Methods for forming tungsten-containing layersKHANDELWAL AMIT·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →