Inventor · disambiguated record
Anson J. Call
Also filed as: CALL ANSON · CALL ANSON J · CALL ANSON JAY
31 granted patents·1 pending application·974 citations·filing 1990–2019
97Inventor score
Top patents by PatentIndex Score
32 records- 0194US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0292US5147084AInterconnection structure and test methodIBM·Filed 1991·Granted Sep 15, 1992·175 cites·14 claims
- 0392US5060844AInterconnection structure and test methodIBM·Filed 1990·Granted Oct 29, 1991·184 cites·15 claims
- 0490US5471027AMethod for forming chip carrier with a single protective encapsulantIBM·Filed 1994·Granted Nov 28, 1995·132 cites·17 claims
- 0587US6300164B1Structure, materials, and methods for socketable ball gridIBM·Filed 2000·Granted Oct 9, 2001·42 cites·16 claims
- 0687US5533256AMethod for directly joining a chip to a heat sinkIBM·Filed 1995·Granted Jul 9, 1996·102 cites·14 claims
- 0785US5659203AReworkable polymer chip encapsulantIBM·Filed 1995·Granted Aug 19, 1997·71 cites·16 claims
- 0884US6297559B1Structure, materials, and applications of ball grid array interconnectionsIBM·Filed 1998·Granted Oct 2, 2001·55 cites·42 claims
- 0983US9105535B2Copper feature design for warpage control of substratesBLACKSHEAR EDMUND·Filed 2012·Granted Aug 11, 2015·6 cites·8 claims
- 1081US9659131B2Copper feature design for warpage control of substratesGLOBALFOUNDRIES INC·Filed 2015·Granted May 23, 2017·3 cites·11 claims
- 1180US10276534B2Reduction of solder interconnect stressIBM·Filed 2017·Granted Apr 30, 2019·2 cites·14 claims
- 1273US10607928B1Reduction of laminate failure in integrated circuit (IC) device carrierIBM·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 1373US9633914B2Split ball grid array pad for multi-chip modulesIBM·Filed 2015·Granted Apr 25, 2017·2 cites·6 claims
- 1473US5930597AReworkable polymer chip encapsulantIBM·Filed 1997·Granted Jul 27, 1999·38 cites·6 claims
- 1569US9865557B1Reduction of solder interconnect stressIBM·Filed 2016·Granted Jan 9, 2018·1 cites·9 claims
- 1665US9563732B1In-plane copper imbalance for warpage predictionIBM·Filed 2016·Granted Feb 7, 2017·1 cites·16 claims
- 1764US6120885AStructure, materials, and methods for socketable ball gridIBM·Filed 1998·Granted Sep 19, 2000·25 cites·18 claims
- 1862US10956649B2Semiconductor package metal shadowing checksIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 1958US7786579B2Apparatus for crack prevention in integrated circuit packagesIBM·Filed 2007·Granted Aug 31, 2010·1 cites·4 claims
- 2057US10423752B2Semiconductor package metal shadowing checksIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 2157US10276535B2Method of fabricating contacts of an electronic package structure to reduce solder interconnect stressIBM·Filed 2017·Granted Apr 30, 2019·0 cites·8 claims
- 2256US6218629B1Module with metal-ion matrix induced dendrites for interconnectionIBM·Filed 1999·Granted Apr 17, 2001·18 cites·11 claims
- 2350US10546096B2Semiconductor package via stack checkingIBM·Filed 2017·Granted Jan 28, 2020·0 cites·19 claims
- 2449US6584684B2Method for assembling a carrier and a semiconductor deviceIBM·Filed 2001·Granted Jul 1, 2003·3 cites·16 claims
- 2549US5955543AAryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resinIBM·Filed 1997·Granted Sep 21, 1999·14 cites·18 claims
- 2648US10483233B2Split ball grid array pad for multi-chip modulesIBM·Filed 2017·Granted Nov 19, 2019·0 cites·17 claims
- 2747US10706204B2Automated generation of surface-mount package designIBM·Filed 2018·Granted Jul 7, 2020·0 cites·17 claims
- 2845US10108753B2Laminate substrate thermal warpage prediction for designing a laminate substrateIBM·Filed 2016·Granted Oct 23, 2018·0 cites·20 claims
- 2944US10770385B2Connected plane stiffener within integrated circuit chip carrierIBM·Filed 2018·Granted Sep 8, 2020·0 cites·8 claims
- 3044US2008072597A1Electrically conductive liquid piston engineIBM·Filed 2006·Application pending·0 cites
- 3138US6114450AAryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resinIBM·Filed 1999·Granted Sep 5, 2000·7 cites·12 claims
- 3237US5759285AMethod and solution for cleaning solder connections of electronic componentsIBM·Filed 1996·Granted Jun 2, 1998·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →