Inventor · disambiguated record
Anilkumar Chandolu
Also filed as: CHANDOLU ANILKUMAR
55 granted patents·13 pending applications·108 citations·filing 2010–2025
98Inventor score
Top patents by PatentIndex Score
68 records- 0198US11233036B2Interconnect structure with redundant electrical connectors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 25, 2022·4 cites·20 claims
- 0297US9397078B1Semiconductor device assembly with underfill containment cavityMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 19, 2016·24 cites·36 claims
- 0396US11444099B2Microelectronic devices with lower recessed conductive structures and related systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 13, 2022·3 cites·16 claims
- 0496US10192852B2Interconnect structure with redundant electrical connectors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 29, 2019·9 cites·17 claims
- 0596US9356009B2Interconnect structure with redundant electrical connectors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted May 31, 2016·17 cites·18 claims
- 0694US9818728B2Interconnect structure with redundant electrical connectors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·7 cites·18 claims
- 0793US11818888B2Apparatuses and memory devices including slot structures extending through stack structuresMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0893US11437391B2Methods of forming microelectronic devices, and related microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 6, 2022·5 cites·26 claims
- 0993US2025359059A1Microelectronic devices with insulative extensions in a lower portion of a tiered stack structureLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1092US10566241B1Methods of forming a semiconductor device, and related semiconductor devices and systemsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 18, 2020·7 cites·27 claims
- 1191US10943888B2Interconnect structure with redundant electrical connectors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 9, 2021·4 cites·20 claims
- 1290US12382637B2Microelectronic devices with lower recessed conductive structures and related methodsLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Aug 5, 2025·0 cites·18 claims
- 1388US11482536B2Electronic devices comprising memory pillars and dummy pillars including an oxide material, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 25, 2022·2 cites·37 claims
- 1487US9768134B2Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnectsMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 19, 2017·5 cites·20 claims
- 1585US11222825B2Integrated circuitry, memory arrays comprising strings of memory cells, methods used in forming integrated circuitry, and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 11, 2022·2 cites·20 claims
- 1684US12250821B2Electronic devices including pillars in array regions and non-array regionsMICRON TECHNOLOGY INC·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 1783US11723196B2Microelectronic devices with support pillars spaced along a slit region between pillar array blocks, and related systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 8, 2023·1 cites·13 claims
- 1883US10916527B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 9, 2021·1 cites·19 claims
- 1981US12010848B2Microelectronic devices with lower recessed conductive structures and related methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 2081US11043412B2Methods of forming microelectronic devices, and related microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 22, 2021·3 cites·11 claims
- 2179US11626388B2Interconnect structure with redundant electrical connectors and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 11, 2023·0 cites·20 claims
- 2279US10276529B2Semiconductor devices including conductive pillarsMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·2 cites·19 claims
- 2379US9780052B2Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 3, 2017·3 cites·24 claims
- 2478US10541229B2Apparatuses and methods for semiconductor die heat dissipationMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 21, 2020·2 cites·24 claims
- 2578US2025203869A1Methods for forming electronic devices including pillars in array regions and non-array regionsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2677US2025071996A1Memory device including multiple decks of memory cells and pillars extending through the decksLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2777US2025096042A1Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory CellsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2877US2024357820A1Microelectronic devices including slot structures extending through pillar structures, and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2976US11871575B2Electronic devices including pillars in array regions and non-array regionsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 3076US2024015969A1Integrated Assemblies, and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3175US12041775B2Electronic devices comprising memory pillars and dummy pillars including an oxide material, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 3275US2023403849A1Microelectronic devices with support pillars spaced along a slit region between pillar array blocks, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3374US10886244B2Collars for under-bump metal structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 5, 2021·2 cites·11 claims
- 3473US12167599B2Memory device including multiple decks of memory cells and pillars extending through the decksLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Dec 10, 2024·0 cites·17 claims
- 3573US10658380B2Formation of termination structures in stacked memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted May 19, 2020·1 cites·24 claims
- 3673US2024371706A1Methods and systems for measuring semiconductor devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 3771US12004351B2Integrated assemblies, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Jun 4, 2024·0 cites·17 claims
- 3871US10957625B2Pillar-last methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 23, 2021·1 cites·14 claims
- 3969US11101280B2Memory arrays and methods used in forming a memory arrayMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 24, 2021·1 cites·42 claims
- 4069US2024099006A1Methods of forming electronic devices including recessed conductive structures and related systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 4168US11800711B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 24, 2023·0 cites·16 claims
- 4267US11705385B2Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs)MICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 4366US12224240B2Microelectronic devices including active contacts and support contacts, and related electronic systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 11, 2025·0 cites·25 claims
- 4466US11631630B2Pillar-last methods for forming semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 4566US11177279B2Formation of termination structures in stacked memory arraysMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 4665US12191254B2Electronic devices including tiered stacks including conductive structures isolated by slot structures, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 7, 2025·0 cites·25 claims
- 4765US11984364B2Methods and systems for measuring semiconductor devicesLODESTAR LICENSING GROUP LLC·Filed 2021·Granted May 14, 2024·0 cites·22 claims
- 4865US11756826B2Forming terminations in stacked memory arraysMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 4965US11532638B2Memory device including multiple decks of memory cells and pillars extending through the decksMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 20, 2022·0 cites·27 claims
- 5065US11387245B2Electronic devices including pillars in array regions and non-array regions, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 12, 2022·0 cites·25 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →