Inventor · disambiguated record
Andrew C. Chang
Also filed as: CHANG ANDREW · CHANG ANDREW C · CHANG ANDREW W
21 granted patents·30 pending applications·93 citations·filing 1997–2025
94Inventor score
Top patents by PatentIndex Score
51 records- 0196US11121590B1Wireless power system with communicationsAPPLE INC·Filed 2020·Granted Sep 14, 2021·10 cites·18 claims
- 0293US9761534B2Semiconductor package, semiconductor device using the same and manufacturing method thereofMEDIATEK INC·Filed 2016·Granted Sep 12, 2017·11 cites·19 claims
- 0392US12308671B2Wireless power system with communicationsAPPLE INC·Filed 2021·Granted May 20, 2025·2 cites·20 claims
- 0491US12308670B2Wireless power system with communicationsAPPLE INC·Filed 2021·Granted May 20, 2025·2 cites·20 claims
- 0588US10573616B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2016·Granted Feb 25, 2020·4 cites·26 claims
- 0687US9177899B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2012·Granted Nov 3, 2015·9 cites·8 claims
- 0780US2025253719A1Wireless Power System with CommunicationsAPPLE INC·Filed 2025·Application pending·0 cites
- 0877US10580747B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Mar 3, 2020·2 cites·21 claims
- 0977US10573615B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Feb 25, 2020·2 cites·21 claims
- 1077US8859340B2Molded interposer package and method for fabricating the sameMEDIATEK INC·Filed 2014·Granted Oct 14, 2014·3 cites·1 claims
- 1174US2025278130A1Management of near field communications using a low power express mode of an electronic deviceAPPLE INC·Filed 2025·Application pending·0 cites
- 1273US5974088ADigital data slicerUNITED MICROELECTRONICS CORP·Filed 1997·Granted Oct 26, 1999·27 cites·4 claims
- 1372US6496126B2Digitization apparatus and method using a finite state machine in feedback loopMEDIATEK INC·Filed 2001·Granted Dec 17, 2002·9 cites·20 claims
- 1471US10354974B2Structure and formation method of chip package structureMEDIATEK INC·Filed 2015·Granted Jul 16, 2019·2 cites·17 claims
- 1570US10186488B2Manufacturing method of semiconductor package and manufacturing method of semiconductor deviceMEDIATEK INC·Filed 2017·Granted Jan 22, 2019·1 cites·20 claims
- 1669US12222794B2Management of near field communications using a low power express mode of an electronic deviceAPPLE INC·Filed 2021·Granted Feb 11, 2025·0 cites·20 claims
- 1765US9040359B2Molded interposer package and method for fabricating the sameMEDIATEK INC·Filed 2014·Granted May 26, 2015·1 cites·13 claims
- 1865US6928038B2Circuit for protecting synchronizing patternsMEDIA TEK INC·Filed 2002·Granted Aug 9, 2005·7 cites·2 claims
- 1964US11469201B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 2063US8957518B2Molded interposer package and method for fabricating the sameGREGORICH THOMAS MATTHEW·Filed 2012·Granted Feb 17, 2015·1 cites·25 claims
- 2158US11693467B2Electronic device functionality in low power modeAPPLE INC·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 2257US11086387B2Management of near field communications using a low power express mode of an electronic deviceAPPLE INC·Filed 2018·Granted Aug 10, 2021·0 cites·21 claims
- 2357US2025159800A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2456US2024282590A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2556US2024243048A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2655US2024213137A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2753US2025014989A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2852US2024096721A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2952US2025105877A1Techniques for Communication of Capabilities in Wireless Charging SystemsAPPLE INC·Filed 2023·Application pending·0 cites
- 3052US2025096105A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 3152US2024282683A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 3252US2023282556A1Substrate structureAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 3352US2025192014A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 3451US2023290744A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 3550US2009245520A1Digital content protection methodsMEDIATEK INC·Filed 2008·Application pending·0 cites
- 3650US2025323062A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 3750US2024096776A1Package substrateAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 3848US2023298986A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 3946US2025308935A1Method for fabricating a package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 4046US2009254717A1Storage system and method thereofMEDIATEK INC·Filed 2008·Application pending·0 cites
- 4146US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 4244US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 4344US2005046603A1Fast digital data recovery circuitFiled 2004·Application pending·0 cites
- 4443US2025300052A1Semiconductor package and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 4542US2025246443A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 4642US2006209880A1Method of audio data transmission and system thereofMEDIATEK INC·Filed 2004·Application pending·0 cites
- 4740US7193944B2Information recording device and method of the sameMEDIATEK INC·Filed 2003·Granted Mar 20, 2007·0 cites·17 claims
- 4839US2004042376A1Information recording methodMEDIATEK INC·Filed 2003·Application pending·0 cites
- 4939US2025253261A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 5032US2013214246A1Light emitting diode and fabrication method thereofNIOU CHORNG·Filed 2011·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →