Inventor · disambiguated record
Antonio Jr. Bambalan Dimaano
Also filed as: DIMAANO ANTONIO JR BAMBALAN · DIMAANO JR ANTONIO
7 granted patents·2 pending applications·21 citations·filing 2008–2019
81Inventor score
Files withUTAC HEADQUARTERS PTE LTD6UNITED TEST & ASSEMBLY CT LT1UNITED TEST & ASSEMBLY CT LTD1UNITED TEST AND ASSEMBLY CENTER LTD1
Top patents by PatentIndex Score
9 records- 0190US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 0285US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 0380US9786625B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 0476US9087777B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jul 21, 2015·3 cites·22 claims
- 0567US9960130B2Reliable interconnectUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted May 1, 2018·2 cites·22 claims
- 0658US2019348387A1Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2019·Application pending·0 cites
- 0755US10403592B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 0855US10354934B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 0943US2009236726A1Package-on-package semiconductor structureUNITED TEST & ASSEMBLY CT LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →