Inventor · disambiguated record
Andrey Grinman
Also filed as: GRINMAN ANDREY
11 granted patents·2 pending applications·215 citations·filing 2006–2019
89Inventor score
Top patents by PatentIndex Score
13 records- 0196US7791199B2Packaged semiconductor chipsTESSERA INC·Filed 2006·Granted Sep 7, 2010·49 cites·8 claims
- 0294US7936062B2Wafer level chip packagingTESSERA TECH IRELAND LTD·Filed 2007·Granted May 3, 2011·75 cites·23 claims
- 0393US7807508B2Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingTESSERA TECH HUNGARY KFT·Filed 2007·Granted Oct 5, 2010·62 cites·21 claims
- 0487US8551815B2Stack packages using reconstituted wafersAVSIAN OSHER·Filed 2008·Granted Oct 8, 2013·21 cites·9 claims
- 0578US9548254B2Packaged semiconductor chips with arrayTESSERA INC·Filed 2015·Granted Jan 17, 2017·2 cites·15 claims
- 0678US8653644B2Packaged semiconductor chips with arrayGRINMAN ANDREY·Filed 2012·Granted Feb 18, 2014·4 cites·60 claims
- 0767US11063159B2Methods for routing electrical interconnections and resultant structuresFLIR SYSTEMS·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 0867US10818550B2Methods for singulation and packagingFLIR SYSTEMS·Filed 2017·Granted Oct 27, 2020·1 cites·20 claims
- 0957US9070678B2Packaged semiconductor chips with arrayTESSERA INC·Filed 2014·Granted Jun 30, 2015·0 cites·19 claims
- 1050US2014027931A1Stack packages using reconstituted wafersTESSERA INC·Filed 2013·Application pending·0 cites
- 1149US8569876B2Packaged semiconductor chips with arrayGRINMAN ANDREY·Filed 2006·Granted Oct 29, 2013·0 cites·94 claims
- 1244US8704347B2Packaged semiconductor chipsGRINMAN ANDREY·Filed 2010·Granted Apr 22, 2014·0 cites·20 claims
- 1340US2007190747A1Wafer level packaging to lidded chipsTESSERA TECH HUNGARY KFT·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Andrey Grinman files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →