Inventor · disambiguated record
Antonius Hendrikus Jozef Kamphuis
Also filed as: KAMPHUIS ANTONIUS HENDRIKUS JOZEF
21 granted patents·2 pending applications·15 citations·filing 2003–2023
90Inventor score
Top patents by PatentIndex Score
23 records- 0189US12142527B2Method and system for regulating plasma dicing ratesNXP BV·Filed 2023·Granted Nov 12, 2024·2 cites·20 claims
- 0275US11721586B2Method and system for regulating plasma dicing ratesNXP BV·Filed 2019·Granted Aug 8, 2023·2 cites·20 claims
- 0371US11881425B2Technique for handling diced wafers of integrated circuitsNXP BV·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0470US11380634B2Apparatuses and methods for coupling a waveguide structure to an integrated circuit packageNXP BV·Filed 2019·Granted Jul 5, 2022·2 cites·18 claims
- 0568US12033950B2Semiconductor device with self-aligned waveguide and method thereforNXP USA INC·Filed 2021·Granted Jul 9, 2024·0 cites·13 claims
- 0668US10998489B2Magnetic shielding structure for MRAM arrayNXP BV·Filed 2019·Granted May 4, 2021·1 cites·19 claims
- 0759US11508606B2Technique for handling diced wafers of integrated circuitsNXP BV·Filed 2019·Granted Nov 22, 2022·0 cites·11 claims
- 0858US12446199B2On-chip shielded deviceNXP BV·Filed 2022·Granted Oct 14, 2025·0 cites·24 claims
- 0958US12315995B2Grounding assembly for a semiconductor deviceNXP BV·Filed 2022·Granted May 27, 2025·0 cites·16 claims
- 1057US10593635B2Multi-die and antenna array deviceNXP BV·Filed 2018·Granted Mar 17, 2020·1 cites·19 claims
- 1156US12114472B2RF component and methodNXP BV·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1254US12212074B2Single die design for different polarizationsNXP BV·Filed 2022·Granted Jan 28, 2025·0 cites·17 claims
- 1354US2024088068A1Semiconductor device with through package via and method thereforNXP USA INC·Filed 2022·Application pending·0 cites
- 1452US11658056B2Technique for handling diced wafers of integrated circuitsNXP BV·Filed 2020·Granted May 23, 2023·0 cites·11 claims
- 1552US7726011B2Chip transfer method and apparatusNXP BV·Filed 2003·Granted Jun 1, 2010·7 cites·22 claims
- 1649US12199333B2Semiconductor device having uniform multi-package antenna array and method of manufactureNXP BV·Filed 2022·Granted Jan 14, 2025·0 cites·14 claims
- 1749US2023290737A1Flip chip device through package via placementNXP BV·Filed 2022·Application pending·0 cites
- 1848US10896878B2Integrated circuit saw bow break pointNXP BV·Filed 2019·Granted Jan 19, 2021·0 cites·15 claims
- 1945US11133578B2Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguideNXP BV·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 2041US10643957B2Conformal dummy dieNXP BV·Filed 2018·Granted May 5, 2020·0 cites·15 claims
- 2137US10431476B2Method of making a plurality of packaged semiconductor devicesNXP BV·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 2236US10942444B2Optical control modules for integrated circuit device patterning and reticles and methods including the sameNXP USA INC·Filed 2019·Granted Mar 9, 2021·0 cites·11 claims
- 2335US10431575B2Multi-die array deviceNXP BV·Filed 2017·Granted Oct 1, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →