Inventor · disambiguated record
Andrew Kao
Also filed as: KAO ANDREW · KAO ANDREW S
5 granted patents·122 citations·filing 1999–2009
82Inventor score
Top patents by PatentIndex Score
5 records- 0193US7382142B2High density interconnect system having rapid fabrication cycleNANONEXUS INC·Filed 2005·Granted Jun 3, 2008·43 cites·29 claims
- 0291US7872482B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2007·Granted Jan 18, 2011·21 cites·24 claims
- 0380US6326553B1Scheme to avoid electrostatic discharge damage to MR/GMR head gimbal/stack assembly in hard disk applicationsSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 4, 2001·48 cites·18 claims
- 0468US6556006B1Method for magneto-resistive head electrostatic popping detectionSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 29, 2003·8 cites·64 claims
- 0561US7884634B2High density interconnect system having rapid fabrication cycleVERIGY PTE LTD SINGAPORE·Filed 2009·Granted Feb 8, 2011·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →