Inventor · disambiguated record
Andrej Kolbasow
Also filed as: KOLBASOW ANDREJ
8 granted patents·6 pending applications·3 citations·filing 2018–2025
74Inventor score
Files withPAC TECH PACKAGING TECH GMBH14
Top patents by PatentIndex Score
14 records- 0187US12028987B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through holePAC TECH—PACKAGING TECH GMBH·Filed 2022·Granted Jul 2, 2024·1 cites·12 claims
- 0281US12349287B2Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through holePAC TECH—PACKAGING TECH GMBH·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0370US11367709B2Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangementPAC TECH—PACKAGING TECH GMBH·Filed 2018·Granted Jun 21, 2022·2 cites·16 claims
- 0469US2025367743A1Bonding Head and Bonding ApparatusPAC TECH PACKAGING TECH GMBH·Filed 2025·Application pending·0 cites
- 0567US2025196244A1Method and laser arrangement for electrically contacting terminal faces of two substratesPAC TECH – PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 0666US2024109144A1Laser-Assisted Soldering ApparatusPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 0764US12358084B2Bonding head and bonding apparatusPAC TECH—PACKAGING TECH GMBH·Filed 2023·Granted Jul 15, 2025·0 cites·24 claims
- 0860US12171066B2Method for removing and repositioning electronic components connected to a circuit boardPAC TECH—PACKAGING TECH GMBH·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 0960US2023105729A1Press-Forming Device for Depositing Solder and Producing Individual Solder BodiesPAC TECH PACKAGING TECH GMBH·Filed 2022·Application pending·0 cites
- 1060US2025038468A1Package Comprising At Least Two Contacts For Microtechnology, Method For Handling A Package, And Tool For Implementing The MethodPAC TECH PACKAGING TECH GMBH·Filed 2024·Application pending·0 cites
- 1149US12485500B2Method for monitoring a laser soldering process, and laser soldering system using a spectroscope devicePAC TECH—PACKAGING TECH GMBH·Filed 2021·Granted Dec 2, 2025·0 cites·10 claims
- 1248US2025235961A1Apparatus and Method for Establishing a Contact ConnectionPAC TECH PACKAGING TECH GMBH·Filed 2023·Application pending·0 cites
- 1347US12023756B2Method for removing electronic components connected to a circuit boardPAC TECH—PACKAGING TECH GMBH·Filed 2021·Granted Jul 2, 2024·0 cites·17 claims
- 1438US11217558B2Method and device for establishing a wire connection as well as a component arrangement having a wire connectionPAC TECH—PACKAGING TECH GMBH·Filed 2018·Granted Jan 4, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →